AMIS-720233-B

AMIS-720233-B: Contact Image Sensor Data Sheet 1.0 General Description The AMIS-720233-B (PI3033B) contact image sensor (CIS) chip is a 200 dot per inch (dpi) resolution, linear array image sensor chip. The sensor chip is processed with AMI Semiconductor’s proprietary CMOS image sensing technology. Designed for cascading multiple chips in a series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a printed circuit board (PCB) in varying sensing array lengths. This CIS chip offers image reading widths to suit document scanners found in facsimile, scanner, check reader and office automation equipment. Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 64 detector elements, their associated multiplexing switches, buffers and a chip selector. The detector's element-to-element spacing is approximately 125um. The size of each chip without scribe lines is 7950um by 500um. Each sensor chip has eight bonding pads. Only seven are used to make the CIS modules. The pad symbols and functions are described in Table 1. 7950 m Row of 64 Sensors and Video Signal Multiplexers Readout Shift Register 500 m Buffer SP Buffer CP VDD DGND Chip Select IOUT RSTLEV Buffer AGND EOS Figure 1: AMIS-720233-B Block Diagram www.DataSheet4U.com Table 1: Pad Symbols and Functions Symbol Function SP Start pulse: input to start the line scan CP Clock pulse: input to clock the shift register VDD Positive supply: +5V supply connected to subs...