FCSP140LTR
Vishay High Power Products
FlipKY® Chip Scale Package Schottky Barrier Rectifier
®
FEATURES
• Ultra low VF ...
FCSP140LTR
Vishay High Power Products
FlipKY® Chip Scale Package
Schottky Barrier Rectifier
®
FEATURES
Ultra low VF per footprint area Low leakage Low thermal resistance One-fifth footprint of SMA Super low profile (0.6 mm) Available tested on tape and reel
RoHS
COMPLIANT
APPLICATIONS
Reverse polarity protection
FlipKY®
Current steering Freewheeling Flyback Oring
DESCRIPTION
Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver
Schottky diodes with the lowest VF to PCB footprint area in industry. The four bump 1.5 x 1.5 mm devices can deliver up to 1 A and occupy only 2.3 mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon enabling designers to strategically place the diodes on the PCB. This design not only minimizes board space but also reduces thermal resistance and inductance, which can improve overall circuit efficiency. Typical applications include hand-held, portable equipment such as cell phones, MP3 players, bluetooth, GPS, PDAs, and portable hard disk drives where space savings and performance are crucial.
PRODUCT SUMMARY
IF(AV) VR 1A 40 V
www.DataSheet4U.com
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL VRRM IF(AV) IFSM VF TJ at 1 Apk, TJ = 125 °C Rectangular waveform CHARACTERISTICS MAX. 40 1 250 0.38 - 55 to 150 UNITS V A V °C
VOLTAGE RATINGS
PARAMETER Maximum DC reverse voltage Maximum working peak reverse voltage SYMBOL VR VRWM FCSP140LTR 40 U...