32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit
i PEM 2.4G b SDRAM-DDR 2.4Gb Austin Semiconductor, Inc. AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated...
Description
i PEM 2.4G b SDRAM-DDR 2.4Gb Austin Semiconductor, Inc. AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit
FEATURES
DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package:
BENEFITS
40 - 70% SPACE SAVINGS Reduced part count Reduced I/O count
208 Plastic Ball Grid Array (PBGA), 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply 2.5V I/O (SSTL_2 compatible) Differential clock inputs (CLK and CLK#) Commands entered on each positive CLK edge Internal pipelined double-data-rate (DDR) architecture; two data accesses per clock cycle Programmable Burst length: 2,4 or 8 Bidirectional data strobe (DQS) transmitted/received with data, i.e., source-synchronous data capture (one per byte) DQS edge-aligned with data for READs; center-aligned with data for WRITEs DLL to align DQ and DQS transitions with CLK Four internal banks for concurrent operation Two data mask (DM) pins for masking write data Programmable IOL/IOH option Auto precharge option Auto Refresh and Self Refresh Modes Industrial, Enhanced and Military Temperature Ranges Organized as 32M x 72/80 Weight: AS4DDR32M72PBG = 2.0 grams typical
34% I/O Reduction
Reduced trace lengths for lower parasitic
capacitance
Suitable for hi-reliability applications Laminate interposer for optimum TCE match PIN/Function compatible to White
W3E32M72S-xSBx
ConfigurationAddressing Parameter Configuration RefreshCount RowAddress BankAddress ColumnAddress...
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