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MAX19999 Dataheets PDF



Part Number MAX19999
Manufacturers Maxim Integrated Products
Logo Maxim Integrated Products
Description 3000MHz to 4000MHz Downconversion Mixer
Datasheet MAX19999 DatasheetMAX19999 Datasheet (PDF)

19-4293; Rev 0; 10/08 www.DataSheet4U.com Dual, SiGe High-Linearity, 3000MHz to 4000MHz Downconversion Mixer with LO Buffer General Description The MAX19999 dual-channel downconverter provides 8.3dB of conversion gain, +24dBm input IP3, +11.4dBm 1dB input compression point, and a noise figure of 10.5dB for 3000MHz to 4000MHz WiMAX™ and LTE diversity receiver applications. With an optimized LO frequency range of 2650MHz to 3700MHz, this mixer is ideal for low-side LO injection architectures. In.

  MAX19999   MAX19999


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19-4293; Rev 0; 10/08 www.DataSheet4U.com Dual, SiGe High-Linearity, 3000MHz to 4000MHz Downconversion Mixer with LO Buffer General Description The MAX19999 dual-channel downconverter provides 8.3dB of conversion gain, +24dBm input IP3, +11.4dBm 1dB input compression point, and a noise figure of 10.5dB for 3000MHz to 4000MHz WiMAX™ and LTE diversity receiver applications. With an optimized LO frequency range of 2650MHz to 3700MHz, this mixer is ideal for low-side LO injection architectures. In addition to offering excellent linearity and noise performance, the MAX19999 also yields a high level of component integration. This device includes two double-balanced passive mixer cores, two LO buffers, and a pair of differential IF output amplifiers. Integrated onchip baluns allow for single-ended RF and LO inputs. The MAX19999 requires a nominal LO drive of 0dBm and a typical supply current of 388mA at VCC = +5.0V or 279mA at VCC = +3.3V. The MAX19999 is pin compatible with the MAX19997A 1800MHz to 2900MHz mixer and pin similar with the MAX19985/MAX19985A and MAX19995/MAX19995A series of 700MHz to 2200MHz mixers, making this entire family of downconverters ideal for applications where a common PCB layout is used across multiple frequency bands. The MAX19999 is available in a compact 6mm x 6mm, 36-pin thin QFN package with an exposed pad. Electrical performance is guaranteed over the extended temperature range, from TC = -40°C to +85°C. o o o o o o o o o o o o o o Features 3000MHz to 4000MHz RF Frequency Range 2650MHz to 3700MHz LO Frequency Range 50MHz to 500MHz IF Frequency Range 8.3dB Conversion Gain +24dBm Input IP3 10.5dB Noise Figure +11.4dBm Input 1dB Compression Point 74dBc Typical 2 x 2 Spurious Rejection at PRF = -10dBm Dual Channels Ideal for Diversity Receiver Applications Integrated LO Buffer Integrated LO and RF Baluns for Single-Ended Inputs Low -3dBm to +3dBm LO Drive Pin Compatible with the MAX19997A 1800MHz to 2900MHz Mixer Pin Similar to the MAX9995/MAX9995A and MAX19995/MAX19995A 1700MHz to 2200MHz Mixers and the MAX9985/MAX9985A and MAX19985/MAX19985A 700MHz to 1000MHz Mixers 39dB Channel-to-Channel Isolation Single +5.0V or +3.3V Supply External Current-Setting Resistors Provide Option for Operating Device in Reduced-Power/ReducedPerformance Mode MAX19999 Applications 3.5GHz WiMAX and LTE Base Stations Fixed Broadband Wireless Access Microwave Links Wireless Local Loop Private Mobile Radios Military Systems Pin Configuration/Functional Diagram and Typical Application Circuit appear at end of data sheet. o o o Ordering Information PART MAX19999ETX+ MAX19999ETX+T TEMP RANGE -40°C to +85°C -40°C to +85°C PIN-PACKAGE 36 Thin QFN-EP* 36 Thin QFN-EP* +Denotes a lead-free/RoHS-compliant package. *EP = Exposed pad. T = Tape and reel. WiMAX is a trademark of WiMAX Forum. ________________________________________________________________ Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. www.DataSheet4U.com Dual, SiGe High-Linearity, 3000MHz to 4000MHz Downconversion Mixer with LO Buffer MAX19999 ABSOLUTE MAXIMUM RATINGS VCC to GND ...........................................................-0.3V to +5.5V RF_, LO to GND.....................................................-0.3V to +0.3V IFM_, IFD_, IFM_SET, IFD_SET, LO_ADJ_M, LO_ADJ_D to GND.................................-0.3V to (VCC + 0.3V) RF_, LO Input Power ......................................................+15dBm RF_, LO Current (RF and LO are DC shorted to GND through balun).................................................................50mA Continuous Power Dissipation (Note 1) ..............................8.7W θJA (Notes 2, 3)..............................................................+38°C/W θJC (Note 3).....................................................................7.4°C/W Operating Case Temperature Range (Note 4) ...................................................TC = -40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Note 1: Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150°C. Note 2: Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is known. The junction temperature must not exceed +150°C. Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.


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