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PI3012A

AMI SEMICONDUCTOR

300DPI CIS Sensor Chip

www.DataSheet4U.com ™ Peripheral Imaging Corporation PI3012A 300DPI CIS Sensor Chip Engineering Data Sheet Descriptio...


AMI SEMICONDUCTOR

PI3012A

File Download Download PI3012A Datasheet


Description
www.DataSheet4U.com ™ Peripheral Imaging Corporation PI3012A 300DPI CIS Sensor Chip Engineering Data Sheet Description: Peripheral Imaging Corporation PI3012A CIS sensor chip is a 300 dot per inch resolution linear array image sensor chip which utilizes PIC’s proprietary CMOS Image Sensing Technology. This image sensor is to be used for butting end-to-end on a printed circuit board (PCB) using chip-on-board technology to form a scanning array with various lengths. Applications for the sensor array are facsimile, scanner, check reader, and office automation equipment. Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 96 detector elements, 8080µm 1 2 3 4 ROW OF 96 SENSORS AND VIDEO SIGNAL LINE MULTIPLEXER 93 94 95 96 READOUT SHIFT REGISTER 380µm BUFFER BUFFER CP VDD DGND CHIP SELECT IOUT BUFFER EOS SP PI3012A SENSOR CHIP FIGURE 1 BLOCK DIAGRAM their associated multiplexing switches, buffers, and a chip selector. The detector element-to-element spacing is approximately 84.6 µm. The size of each chip without scribe lines is 8080 µm by 380 µm. Each sensor chip has 6 bonding pads. The pad symbols and functions are described in Table 1. PAGE 1 of 7 PI3012A6, 6/9/99 www.DataSheet4U.com SYMBOL SP CP VDD DGND IOUT EOS FUNCTION Start Pulse: Input to start the line scan. Clock Pulse: Input to clock the Shift Register. Positive Supply: +5 volt supply connected to substrate. Digital Ground: Connection topside common. Signal Current Output: Ou...




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