IRLBL1304

PD- 91843A www.datasheet4u.com IRLBL1304 HEXFET® Power MOSFET D l l l l l l l >1mm lower profile than D2Pak Same footprint as D2pak Logic Level Gate Surface mount Ultra Low On-Resistance Fully Avalanche Rated 50% greater current in typ. application condition vs. D2Pak VDSS = 40V G S RDS(on) = 0.0045Ω ID = 185A… Description The HEXFET® MOSFET is the most popular power MOSFET in the world. This particular HEXFET® MOSFET is in the SuperD2PakTM and has the same outline and pinout as the standard D 2Pak but has increased current handling capability and >1mm lower profile. This makes it ideal to reduce component count in multiparallel D2Pak operation, reduce system power dissipation or upgrade existing design. This package has also been designed to meet automotive qualification standard Q101 and can be used with normal surface mouting equipment and has the same temperature profile and recommendations as the commonly used D 2Pak. Super-D2PakTM Absolute Maximum Ratings Parameter ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C VGS EAS IAR EAR dv/dt TJ TSTG Continuous Drain Current, VGS @ 10V† Continuous Drain Current, VGS @ 10V† Pulsed Drain Current † Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy‚† Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt ƒ† Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Max. 185, pkg limited to 95A* 130, pkg limited to 95A* 740 300 2.0 ±...