SOT23-5

www.DataSheet4U.com Package information - SOT23-5 Surface mounted, 5 pin package Package outline DIM A A1 A2 b C D E E1 e e1 L a° Min. 0.90 0.00 0.90 0.20 0.09 2.70 2.20 1.30 Millimeters Max. 1.45 0.15 1.30 0.50 0.26 3.10 3.20 1.80 0.95 REF 1.90 REF 0.10 0° 0.60 30° 0.0039 0° Min. 0.0354 0.00 0.0354 0.0078 0.0035 0.1062 0.0866 0.0511 Inches Max. 0.0570 0.0059 0.0511 0.0196 0.0102 0.1220 0.1181 0.0708 0.0374 REF 0.0748 REF 0.0236 30° Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Soldering footprint 0.95 0.375 1.06 0.042 2.2 0.087 0.65 0.025 mm inches Issue 1 - September 2005 © Zetex Semiconductors plc 2005 1 www.zetex.com www.DataSheet4U.com Package information - SOT23-5 Nominal weight Nominal weight per device 12mg. Tape and reel information Orientation Tape width (mm) 8 8 Reel size (inches) 7 13 No. of components 3,000 10,000 Tape option indicator TA TC Embossed carrier tape configuration P0 K t Top cover tape 10 pitches culmulative tolerance on tape ±0.2mm (±0.008”) D P2 E See Note 1 A0 See Note 1 F W B1 K0 See Note 1 B0 P Embossment Center lines of cavity D1 User direction of feed Dimensions mm (inches) A0, B0, K0 B1 (max.) D D1 (max.) E F P Tape size (mm) 8 See note * 12 See note * 16 See note * 24 See note* 20.10 (0.791) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 ± 0.10 11.50 ± 0.10 (0.453 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) to 20.00 ± 0.10 (0.787 ± 0.004) in 4.00 (0.157) increments 4.00 ± 0.10 2...