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DAC2932
SBAS279C − AUGUST 2003 − REVISED OCTOBER 2004
Dual, 12ĆBit, 40MSPS DigitalĆtoĆAnalog Converter
FEATURES D Dual, 12-Bit, 40MSPS Current Output DAC D Four 12-Bit Voltage Output DACs—for
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DESCRIPTION
The DAC2932 is a dual 12-bit, current-output digital-to-analog converter (DAC) designed to combine the features of high dynamic range and very low power consumption. The DAC2932 converter supports update rates of up to 40MSPS. In addition, the DAC2932 features four 12-bit voltage output DACs, which can be used to perform system control functions. The advanced segmentation architecture of the DAC2932 is optimized to provide a high spurious-free dynamic range (SFDR). The DAC2932 has a high impedance (> 200kΩ) differential current output with a nominal range of 2mA and a compliance voltage of up to 0.8V. The differential outputs allow for either a differential or single-ended analog signal interface. The close matching of the current outputs ensures superior dynamic performance in the differential configuration, which can be implemented with a transformer. Using a small geometry CMOS process, the monolithic DAC2932 is designed to operate within a single-supply range of 2.7V to 3.3V. Low power consumption makes it ideal for portable and battery-operated systems. Further optimization by lowering the output current can be realized with the adjustable full-scale option. The full-scale output current can be adjusted over a span of 0.5mA to 2mA. For noncontinuous operation of the DAC2932, a full power-down mode can reduce the power dissipation to as little as 25µW. The DAC2932 is designed to operate with a single parallel data port. While it alternates the loading of the input data into separate input latches for both current output DACs (I-DACs), the updating of the analog output signal occurs simultaneously. The DAC2932 integrates a temperature compensated 1.22V bandgap reference. The DAC2932 also allows for additional flexibility of using an external reference. The DAC2932 is available in a TQFP-48 package.
D Single +3V Operation D Very Low Power: 29mW D High SFDR: 75dB at fOUT = 5MHz D Low-Current Standby or Full Power-Down
Modes
D Internal Reference D Optional External Reference D Adjustable Full-Scale Range: 0.5mA to 2mA APPLICATIONS D Transmit Channels
− I and Q − PC Card Modems: GPRS, CDMA − Wireless Network Cards (NICs) Signal Synthesis (DDS) Portable Medical Instumentation Arbitrary Waveform Generation (AWG)
D D D
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright 2003−2004, Texas Instruments Incorporated
www.ti.com
DAC2932
www.ti.com SBAS279C − AUGUST 2003 − REVISED OCTOBER 2004
ORDERING INFORMATION
PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR(1) PFB SPECIFIED TEMPERATURE RANGE −40°C to +85°C PACKAGE MARKING DAC2932 ORDERING NUMBER DAC2932PFBT DAC2932PFBR TRANSPORT MEDIA, QUANTITY Tape and Reel, 250 Tape and Reel, 2000
DAC2932
TQFP-48
(1) For the most current specification and package information, refer to our web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted DAC2932 www.DataSheet4U.com +VA to AGND +VD to DGND AGND to DGND +VA to +VD CLK, PD, STBY, CS to DGND D0−D11 to DGND IOUT, IOUT to AGND REFV to AGNDV GSET, REFIN, FSA to AGND VOUTx to AGNDV DIN to DGNDV Junction temperature Case temperature Storage temperature range −0.3 to +4 −0.3 to +4 −0.2 to +0.2 −0.7 to +0.7 −0.3 to VD + 0.3 −0.3 to VD + 0.3 −0.5 to VA + 0.3 −0.3 to VAV + 0.3 −0.3 to VA + 0.3 −0.3 to VAV + 0.3 −0.3 to VDV + 0.3 +150 +100 −40 to +150 UNIT V V V V V V V V V V V °C °C °C
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
FUNCTIONAL BLOCK DIAGRAM
REFIN STBY CS PD Clock Input Latch and De− Multiplexer CLK Data1 CLK1 DAC Latch 1 12− Bit 40MSPS I− DAC1 IOUT1 IOUT1 GSET FSA1 FSA2 +VA AGND +VD DGND DAC2932
+1.22V Reference
Reference Control Amp
Parallel Data Input, [D0:D11]
12− Bit Data, Interleaved
Data2 CLK2
DAC Latch 2
12− Bit 40MSPS I− DAC2
IOUT2 IOUT2
I− DAC Section 12 A0 Serial− to− Parallel Shift Register DIN Dx Latch 12− Bit.