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ICS83026I-01

Integrated Device Technology

1-TO-2 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER

ICS83026I-01 LOW SKEW, 1-TO-2 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER GENERAL DESCRIPTION The ICS83026I-01 is a low s...



ICS83026I-01

Integrated Device Technology


Octopart Stock #: O-631641

Findchips Stock #: 631641-F

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Description
ICS83026I-01 LOW SKEW, 1-TO-2 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER GENERAL DESCRIPTION The ICS83026I-01 is a low skew, 1-to-2 Differential-to-LVCMOS/LVTTL Fanout Buffer and HiPerClockS™ a member of the HiPerClockS ™ family of High Perfor mance Clock Solutions from I DT . The differential input can accept most differential signal types (LVPECL, LVDS, LVHSTL, HCSL and SSTL) and translate to two single-ended LVCMOS/LVTTL outputs. The small 8-lead SOIC footprint makes this device ideal for use in applications with limited board space. www.DataSheet4U.com FEATURES Two LVCMOS / LVTTL outputs Differential CLK, nCLK input pair CLK, nCLK pair can accept the following differential input levels: LVPECL, LVDS, LVHSTL, HCSL, SSTL Maximum output frequency: 350MHz Output skew: 15ps (maximum) Part-to-part skew: 600ps (maximum) Additive phase jitter, RMS: 0.03ps (typical) Small 8 lead SOIC package saves board space 3.3V core, 3.3V, 2.5V or 1.8V output operating supply -40°C to 85°C ambient operating temperature Available in both standard (RoHS 5) and lead-free RoHS (6) packages IC S BLOCK DIAGRAM PIN ASSIGNMENT VDD CLK nCLK OE 1 2 3 4 8 7 6 5 VDDO Q0 Q1 GND Q0 CLK nCLK Q1 ICS83026I-01 8-Lead SOIC 3.8mm x 4.8mm, x 1.47mm package body M Package Top View OE VDD CLK nCLK OE 1 2 3 4 8 7 6 5 VDDO Q0 Q1 GND ICS83026I-01 8-Lead TSSOP 4.40mm x 3.0mm x 0.925mm package body G Package Top View 83026BMI-01 1 REV. A OCTOBER 22, 2007 ICS83026I-01 LOW SKEW, 1-TO-2 ...




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