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K9K2G08U1A

Samsung semiconductor

128M x 8 Bit / 256M x 8 Bit NAND Flash Memory

K9F1G08R0A K9F1G08U0A K9K2G08U1A FLASH MEMORY Document Title 128M x 8 Bit / 256M x 8 Bit NAND Flash Memory Revision H...


Samsung semiconductor

K9K2G08U1A

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K9F1G08R0A K9F1G08U0A K9K2G08U1A FLASH MEMORY Document Title 128M x 8 Bit / 256M x 8 Bit NAND Flash Memory Revision History Revision No 0.0 0.1 History 1. Initial issue 1. The tADL(Address to Data Loading Time) is added. - tADL Minimum 100ns (Page 11, 23~26) - tADL is the time from the WE rising edge of final address cycle to the WE rising edge of first data cycle at program operation. 2. Added Addressing method for program operation Draft Date Aug. 24. 2003 Jan. 27. 2004 Remark Advance Preliminary www.DataSheet4U.com 0.2 0.3 0.4 1. Add the Protrusion/Burr value in WSOP1 PKG Diagram. 1. PKG(TSOP1, WSOP1) Dimension Change 1. Technical note is changed 2. Notes of AC timing characteristics are added 3. The description of Copy-back program is changed 4. Voltage range is changed -1.7V~1.95V -> 1.65V~1.95V 5. Note2 of Command Sets is added 1. CE access time : 23ns->35ns (p.11) 1. The value of tREA for 3.3V device is changed.(18ns->20ns) 2. EDO mode is added. 1. The flow chart to creat the initial invalid block table is cahnged. Apr. 23. 2004 May. 19. 2004 Jan. 21. 2005 Preliminary Preliminary Preliminary Feb. 14. 2005 0.5 0.6 May. 24. 2005 Preliminary 0.7 May 6. 2005 The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the SAMSUNG branch o...




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