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TB386

Intersil Corporation

Implementing the HIP1011 on Hot Swap CPCI Boards

TM Implementing the HIP1011 on Hot Swap CPCI Boards for High Availability (HA) Platforms Technical Brief August 2000 TB...



TB386

Intersil Corporation


Octopart Stock #: O-626390

Findchips Stock #: 626390-F

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TM Implementing the HIP1011 on Hot Swap CPCI Boards for High Availability (HA) Platforms Technical Brief August 2000 TB386 P RE L I M I NA R Y Introduction The October 1999 release of the CompactPCI Specification PICMG 2.0 R3.0 defines for the CPCI environment such developments as 66MHz operation, 3.3V signaling, the addition of the System Manager, further definition and differentiation of Hot Swap (PICMG 2.1 R1.0) and improved mechanical features. Until now, CPCI Hot Swap features were offered as a vendor proprietary feature with little or no interoperability. www.DataSheet4U.com PICMG 2.1 R1.0 now defines three Hot Swap system models: Basic, Full and High Availability (HA) each of increasing complexity and automation. Intersil Tech Brief TB358 details the implementation of the HIP1011 on boards for the Basic and Full models. This Tech Brief details important specification enhancements as they pertain to Hot Swap and the HIP1011 solution for boards to be used in HA System platforms. HA Normal Insertion Sequence Figure 1 is a simple diagram illustrating the progression of a normal insertion. A more detailed state diagram can be found in PICMG 2.1 R1.0 section 2.4. In the following state diagrams Px = Physical connection state, Hx = Hardware connection state and Sx = Software connection state. P0 PHYSICAL BOARD INSERTION As the board is being connected onto the system bus, the ground plane and early power are first connected via the longest pins. The HIP1011 is ground referen...




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