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HY5PS56421F Dataheets PDF



Part Number HY5PS56421F
Manufacturers Hynix
Logo Hynix
Description 256Mb DDR2 SDRAM
Datasheet HY5PS56421F DatasheetHY5PS56421F Datasheet (PDF)

HY5PS56421(L)F HY5PS56821(L)F HY5PS561621(L)F www.DataSheet4U.com 256Mb DDR2 SDRAM HY5PS56421(L)F HY5PS56821(L)F HY5PS561621(L)F This document is a general product description and is subject to change without notice. Hynix Electronics does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.0/ July. 2004 1 HY5PS56421(L)F HY5PS56821(L)F HY5PS561621(L)F Revision History Rev. 0.1 0.2 0.3 www.DataSheet4U.com1.0 History Initial Release Editorial cle.

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HY5PS56421(L)F HY5PS56821(L)F HY5PS561621(L)F www.DataSheet4U.com 256Mb DDR2 SDRAM HY5PS56421(L)F HY5PS56821(L)F HY5PS561621(L)F This document is a general product description and is subject to change without notice. Hynix Electronics does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.0/ July. 2004 1 HY5PS56421(L)F HY5PS56821(L)F HY5PS561621(L)F Revision History Rev. 0.1 0.2 0.3 www.DataSheet4U.com1.0 History Initial Release Editorial clean up, changed tRAS spec. for DDR2 400 1) Defined IDD Spec. 2) Added Speed bins table in AC timming specification Transfered Functional description, command truth table pages and Some contents of Operating conditions to Draft Date Dec. 2003 Jan. 2004 May 2004 Jul. 2004 Rev 1.0/July. 2004 2 HY5PS56421(L)F HY5PS56821(L)F HY5PS561621(L)F Contents 1. Description 1.1 Device Features and Ordering Information 1.1.1 Key Feaures 1.1.2 Ordering Information 1.1.3 Ordering Frequency 1.2 Pin configuration 1.3 Pin Description www.DataSheet4U.com 2. Maximum DC ratings 2.1 Absolute Maximum DC Ratings 2.2 Operating Temperature Condition 3. AC & DC Operating Conditions 3.1 DC Operating Conditions 5.1.1 Recommended DC Operating Conditions(SSTL_1.8) 5.1.2 ODT DC Electrical Characteristics 3.2 DC & AC Logic Input Levels 3.2.1 Input DC Logic Level 3.2.2 Input AC Logic Level 3.2.3 AC Input Test Conditions 3.2.4 Differential Input AC Logic Level 3.2.5 Differential AC output parameters 3.3 Output Buffer Levels 3.3.1 Output AC Test Conditions 3.3.2 Output DC Current Drive 3.3.3 OCD default chracteristics 3.4 IDD Specifications & Measurement Conditions 3.5 Input/Output Capacitance 4. AC Timing Specifications 5. Package Dimensions Rev 1.0 / July. 2004 3 HY5PS56421(L)F HY5PS56821(L)F HY5PS561621(L)F 1. Description 1.1 Device Features & Ordering Information 1.1.1 Key Features • • www.DataSheet4U.com • • • • • • • • • • • • • • • • • • • • • • • VDD=1.8V VDDQ=1.8V +/- 0.1V All inputs and outputs are compatible with SSTL_18 interface Fully differential clock inputs (CK, /CK) operation Double data rate interface Source synchronous-data transaction aligned to bidirectional data strobe (DQS, DQS) Differential Data Strobe (DQS, DQS) Data outputs on DQS, DQS edges when read (edged DQ) Data inputs on DQS centers when write(centered DQ) On chip DLL align DQ, DQS and DQS transition with CK transition DM mask write data-in at the both rising and falling edges of the data strobe All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock Programmable CAS latency 3, 4, 5 and 6 supported Programmable additive latency 0, 1, 2, 3, 4 and 5 supported Programmable burst length 4/8 with both nibble sequential and interleave mode Internal four bank operations with single pulsed RAS Auto refresh and self refresh supported tRAS lockout supported 8K refresh cycles /64ms JEDEC standard 60ball FBGA(x4/x8) & 84ball FBGA(x16) Full strength driver option controlled by EMRS On Die Termination supported Off Chip Driver Impedance Adjustment supported Read Data Strobe suupported (x8 only) Self-Refresh High Temperature Entry Ordering Information Part No. HY5PS56421(L)F-X* HY5PS56821(L)F-X* HY5PS561621(L)F-X* Configuration Package 64Mx4 32Mx8 16Mx16 60Ball FBGA 84Ball FBGA Operating Frequency Grade -E3 -E4 -C4 -C5 -Y5 -Y6 tCK(ns) 5 5 3.75 3.75 3 3 CL 3 4 4 5 5 6 tRCD 3 4 4 5 5 6 tRP 3 4 4 5 5 6 Unit Clk Clk Clk Clk Clk Clk Note: -X* is the speed bin, refer to the Operation Frequency table for complete Part No. Rev 1.0/July. 2004 4 HY5PS56421(L)F HY5PS56821(L)F HY5PS561621(L)F 1.2 Pin Configuration & Address Table 64Mx4 DDR2 Pin Configuration 1 VDD www.DataSheet4U.com 2 NC VSSQ DQ1 VSSQ VREF CKE 3 VSS DM VDDQ DQ3 VSS WE BA1 A1 A5 A9 NC A B C D E F G H J K L 7 VSSQ DQS VDDQ DQ2 VSSDL RAS CAS A2 A6 A11 NC 8 DQS VSSQ DQ0 VSSQ CK CK CS A0 A4 A8 A13 9 VDDQ NC VDDQ NC VDD ODT NC VDDQ NC VDDL NC BA0 A10 VDD VSS A3 A7 VSS VDD A12 ROW AND COLUMN ADDRESS TABLE ITEMS # of Bank Bank Address Auto Precharge Flag Row Address Column Address Page size 64Mx4 4 BA0, BA1 A10/AP A0 - A12 A0-A9, A11 1 KB Rev 1.0 / July. 2004 5 HY5PS56421(L)F HY5PS56821(L)F HY5PS561621(L)F 32Mx8 DDR2 PIN CONFIGURATION 1 www.DataSheet4U.com 2 NU, RDQS VSSQ DQ1 VSSQ VREF CKE 3 VSS DM, RDQS VDDQ DQ3 VSS WE BA1 A1 A5 A9 NC A B C D E F G H J K L 7 VSSQ DQS VDDQ DQ2 VSSDL RAS CAS A2 A6 A11 NC 8 DQS VSSQ DQ0 VSSQ CK CK CS A0 A4 A8 A13 9 VDDQ DQ7 VDDQ DQ5 VDD ODT VDD DQ6 VDDQ DQ4 VDDL NC BA0 A10 VDD VSS A3 A7 VSS VDD A12 ROW AND COLUMN ADDRESS TABLE ITEMS # of Bank Bank Address Auto Precharge Flag Row Address Column Address Page size 32Mx8 4 BA0, BA1 A10/AP A0 - A12 A0-A9 1 KB Rev 1.0/July. 2004 6 HY5PS56421(L)F HY5PS56821(L)F HY5PS561621(L)F 16Mx16 DDR2 PIN CONFIGURATION 1 VDD www.DataSheet4U.com 2 NC VSSQ DQ9 VSSQ NC VSSQ DQ1 VSSQ VREF CKE 3 VSS UDM VDDQ DQ11 VSS LDM VDDQ D.


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