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TQHBT3

TriQuint Semiconductor
Part Number TQHBT3
Manufacturer TriQuint Semiconductor
Description InGaP HBT Foundry Service
Published Aug 26, 2008
Detailed Description Production Process InGaP HBT Foundry Service Features Metal 2 - 4um TQHBT3 • • • • • MIM Metal 0 Isolation Implant D...
Datasheet PDF File TQHBT3 PDF File

TQHBT3
TQHBT3

Overview
Production Process InGaP HBT Foundry Service Features Metal 2 - 4um TQHBT3 • • • • • MIM Metal 0 Isolation Implant Dielectric Metal 1 - 2um Dielectric E Emitter Metal 1 - 2um com B C B C NiCr Base Collector • • • Sub Collector Buffer & Substrate • TQHBT3 Process Cross-Section • General Description TriQuint’s new TQHBT3 process is a highly reliable InGaP HBT process with three levels of interconnecting metal and state-of-the-art device performance.
Thick metal interconnects and high quality passives promote integration.
The thick metal interconnects, which promote enhanced thermal management, and high density capacitors keep die sizes small.
MOCVD epitaxial proce...


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