Advanced Boot Block Flash Memory
Intel£ Advanced+ Boot Block Flash Memory (C3)
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)
Datasheet
Product Features
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Description
Intel£ Advanced+ Boot Block Flash Memory (C3)
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)
Datasheet
Product Features
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Flexible SmartVoltage Technology — 2.7 V– 3.6 V Read/Program/Erase — 12 V for Fast Production Programming 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option — Reduces Overall System Power High Performance — 2.7 V– 3.6 V: 70 ns Max Access Time Optimized Architecture for Code Plus Data Storage — Eight 4 Kword Blocks, Top or Bottom Parameter Boot — Up to One Hundred-Twenty-Seven 32 Kword Blocks — Fast Program Suspend Capability — Fast Erase Suspend Capability Flexible Block Locking — Lock/Unlock Any Block — Full Protection on Power-Up — WP# Pin for Hardware Block Protection Low Power Consumption — 9 mA Typical Read — 7 A Typical Standby with Automatic Power Savings Feature (APS) Extended Temperature Operation — –40 °C to +85 °C
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128-bit Protection Register — 64 bit Unique Device Identifier — 64 bit User Programmable OTP Cells Extended Cycling Capability — Minimum 100,000 Block Erase Cycles Software — Intel® Flash Data Integrator (FDI) — Supports Top or Bottom Boot Storage, Streaming Data (e.g., voice) — Intel Basic Command Set — Common Flash Interface (CFI) Standard Surface Mount Packaging — 48-Ball µBGA*/VFBGA — 64-Ball Easy BGA Packages — 48-Lead TSOP Package ETOX™ VIII (0.13 µm) Flash Technology — 16, 32 Mbit ETOX™ VII (0.18 µm) Flash Technology — 16, 32, 64 Mbit ETOX™ VI (0.25 µm) Flash Technology — 8, 16 and...
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