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MICROWAVE SILICON COMPONENTS
Contents
MICROWAVE SILICON COMPONENTS
CONTENTS CONTENTS
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w e N f o t i y Spir nolog Tech
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INTRODUCTION / SYMBOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-2 SILICON PIN DIODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-4
All specifications contained in that catalog are subject to change without notice.
SCHOTTKY DIODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-28 TUNING VARACTORS DIODES
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12-31
POWER GENERATION DIODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-40 CASE STYLES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-47 MOS CAPACITORS: Please consult page 7-39 of this catalog
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12-1 Vol. 1
MICROWAVE SILICON COMPONENTS
Introduction
INTRODUCTION
This part of the Microwave section presents TEMEX product lines including: • •
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receiving diodes control diodes tuning varactors multiplier varactors step recovery diodes high voltage PIN diodes
• • • •
TEMEX products are available in a complete assortment of packages including: • • • • • chips standard surface mount ceramic and plastic non magnetic custom
IN-HOUSE PRODUCTION
The silicon slice is the in-house starting point of TEMEX product manufacturing. From the virgin wafer, TEMEX performs all functions, including: • • • • • • • • epitaxy diffusion photomasking metallization passivation dicing packaging control and burn-in
TEMEX uses and controls ten separate silicon-related technologies, e.g. all Schottky metallurgies, all junction passivations, and all mesa operations.
12-2 Vol. 1
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MICROWAVE SILICON COMPONENTS
Symbols
SYMBOLS
Cb Cj CT CX/Cy f
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Case Capacitance Junction Capacitance Total Capacitance Tuning Ratio Test Frequency Cut-off Frequency Frequency Input Intermediate Frequency Output Frequency Operating frequency Forward Continuous Current Reverse Continuous Current Reverse Pulse Current Conversion Loss Not Applicable Single Sideband Noise Figure Noise Figure of Intermediate Frequency Gold Contact Diameter CW Power Capability Power Dissipation Power Input Limiting Threshold Local Oscillator Power Output Power RF Power Figure of Merit Forward Series Resistance Thermal Resistance Video Resistance Minority Carrier Lifetime Reverse Switching Time Junction Temperature Snap-off Time Tangential Sensitivity Breakdown Voltage Forward Continuous Voltage Applicable Voltage (RF + bias) Voltage Standing Wave Ratio Forward Threshold Voltage Threshold Voltage Impedance at Intermediate Frequency Output Impedance
12-3 Vol. 1
FI FIF FO Foper IF IR IRP L N/A NFSSB NFIF ∅ PCW Pdiss Pin PL PLO PO PRF Q-X RSF Rth RV TCR Tj tSO TSS VBR VF VR VSWR VT VTO ZIF ZO
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SILICON PIN DIODES
Selection guide
SILICON PIN DIODES
Selection Guide
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HOW TO SPECIFY A PIN DIODE? SURFACE MOUNT PACKAGE
- PLASTIC PACKAGE SWITCHING SILICON PIN DIODES .