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STA240 Dataheets PDF



Part Number STA240
Manufacturers STMicroelectronics
Logo STMicroelectronics
Description service & source decoder
Datasheet STA240 DatasheetSTA240 Datasheet (PDF)

STA240 Sirius SDARS channel, service & source decoder Data Brief Features ■ 2 Satellite and 1 terrestrial signal demodulators www.DataSheet4U.com and decoders ■ ■ Advanced DSP processor to implement PAC audio decoder Requires a single 17MHz clock reference; all high-speed clock signals are derived using on-chip PLL Programmable I2S to support 32K/48K/44.1K audio sample rate (32K/48K Sample rates use internal clocks, 44.1K Sample rate uses external clock) I2C master interface to control tuner a.

  STA240   STA240



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STA240 Sirius SDARS channel, service & source decoder Data Brief Features ■ 2 Satellite and 1 terrestrial signal demodulators www.DataSheet4U.com and decoders ■ ■ Advanced DSP processor to implement PAC audio decoder Requires a single 17MHz clock reference; all high-speed clock signals are derived using on-chip PLL Programmable I2S to support 32K/48K/44.1K audio sample rate (32K/48K Sample rates use internal clocks, 44.1K Sample rate uses external clock) I2C master interface to control tuner and audio DAC External control through uart interface using sirius standard protocol (SSP) over RS-232 LBGA288 ■ ■ ■ Description STA240 is a fully integrated 3rd generation Baseband signal processor for Sirius Satellite Digital Radio Service (SDARS). It is implemented using ST Micro's advanced 0.13µm HCMOS9 technology. It allows a highly efficient implementation of a Sirius “SDARS Satellite Digital Audio Radio Service” receiver when used with its companion STA210 tuner ASIC. STA240 is packaged in a low profile BGA (LBGA 19x19) Analog to digital converters ■ Three internal 10 BIT A/D converters for 76.5MHZ if signals conversion Low power technology ■ ■ 1.2V, 0.13 µm technology 3.3V capable I/OS Table 1. Device summary Part Number STA240 Package LBGA288 Packing Tray June 2007 Rev 1 1/6 www.st.com 6 For further information contact your local STMicroelectronics sales office. Application block diagram STA240 1 Application block diagram Figure 1. Application block diagram FLASH 1M x 16 www.DataSheet4U.com STA210N Tuner FE IF I2C IFAGC STA240 STA240 Baseband Baseband Processor Processor Audio/I 2S Data SDRAM 8Mbx8 or 16Mx8 AC00142 2/6 STA240 Electrical specifications 2 2.1 Electrical specifications Absolute maximum ratings Table 2. Symbol VDD VDDIO Absolute maximum ratings Parameter 1.2V Power supply voltage 3.3V Power supply voltage 1.2V Power supply voltage 3.3V Power supply voltage 1.2V Power supply voltage Voltage on input pin Voltage on output pin Storage temperature Operative ambient temperature Operative junction temperature Value -0.5 to 2 -0.5 to 4 -0.5 to 2 -0.5 to 4 -0.5 to 2 -0.5 to (VDDIO + 0.5) -0.5 to (VDDIO + 0.5) -55 to +150 -40 to +85 -40 to +125 Unit V V V V V V V °C °C °C www.DataSheet4U.com AD_VDD AD_VDD3 APLL_VDD Vi Vo Tstg Top Tj 2.2 Thermal data Table 3. Symbol Rth j-case Rth j-amb Thermal Data Parameter Thermal resistance junction to case Thermal resistance junction to ambient (1) Value 10 31 Unit °C/W °C/W 1. According to JEDEC specification on a 4 layers board 3/6 Package information STA240 3 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. www.DataSheet4U.com Figure 2. LBGA 288 mechanical data & package dimensions mm Ref. MIN. A A1 A2 A3 A4 b D D1 e E E1 F ddd eee fff 0.450 0.500 0.270 1.085 0.300 0.800 TYP. MAX. 1.700 0.0106 0.0427 0.0118 0.0315 MIN. TYP. MAX. 0.0669 inch OUTLINE AND MECHANICAL DATA 0.550 0.0177 0.0197 0.0217 18.800 19.000 19.200 0.7402 0.7480 0.7559 17.000 1.000 0.6693 0.0394 18.800 19.000 19.200 0.7402 0.7480 0.7559 17.000 1.000 0.200 0.250 0.100 0.6693 0.0394 0.0079 0.0098 0.0039 LBGA288 (19x19x1.70) Low Profile Ball Grid Array Bottom view 7131786 C 4/6 STA240 Revision history 4 Revision history Table 4. Date 18-Jun-2007 Document revision history Revision 1 Initial release. Changes www.DataSheet4U.com 5/6 STA240 www.DataSheet4U.com Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN.


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