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TSF-6522

ETC

No-Clean Tacky Soldering Flux

M Litton Kester Solder TSF-6522 No-Clean Tacky Soldering Flux Product Description Kester formula TSF-6522 is a no-cle...


ETC

TSF-6522

File Download Download TSF-6522 Datasheet


Description
M Litton Kester Solder TSF-6522 No-Clean Tacky Soldering Flux Product Description Kester formula TSF-6522 is a no-clean tacky soldering flux formula designed to be used with a rotating disc, a doctor blade, or a drum fluxer. The TSF-6522 can also be used in dot dispensing for BGA/PGA sites or in a www.DataSheet4U.com rework application for surface mount packages. TSF-6522 maintains its activity and dispensing characteristics for up to 8 hours and can be used in a wide range of temperature and humidity conditions. Kester maintains the highest standards by manufacturing the TSF-6522 under a vacuum environment. High tack values and long tack life Leaves bright/shiny solder joints after reflow ANSI/J-STD-004 flux designator ROL0 Can reflow in air or nitrogen environments Copper Mirror Corrosion: Low Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 pH 5% Solution: 7.7 Kester Method #1W-QC-G-15 Qualitative Halide Tests: Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 Typical S.I.R., IPC: Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3, (B-24 coupon) 10 Blank at 24 hours: 3.08 x 10 ohms Blank at 96 hours: 1.27 x 1010 ohms Blank at 168 hours: 8.79 x 109 ohms Physical Properties (typical) Viscosity: 285 poise Kester Method #1W-QC-3-09 Uncleaned at 24 hours: 2.56 x 108 ohms Uncleaned at 96 h...




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