CD4519B

Technical Overview CD4000B Series This section is intended as a guide for circuit and equipment designers in the operation and application of MOS integrated circuits. It covers general operating and handling considerations with respect to the following critical factors: Operating Supply Voltage Range Power Dissipation and Derating System Noise Considerations Power Source Rules Gate-oxide Protection Networks Input Signals and Ratings Chip Assembly and Storage www.DataSheet4U.com Device Mounting Testing More specific information is then given on significant features, special design and application requirements, and standard ratings and electrical characteristics for CMOS Bseries logic circuits, and on CMOS special function circuits (special interface and display driver circuits). Dynamic power dissipation has three components: 1. The dissipation that results from current that charges and discharges the external load capacitance of the output buffers. The dissipation of each output buffer is equal to CV2f, where C is the load capacitance, V is the supply voltage, and f is the switching frequency of that output. 2. The dissipation that results from current that charges and discharges the internal node capacitances. 3. The dissipation caused by the current spikes through the PMOS and NMOS transistors in series at the instant of switching. This component amounts to approximately 10% of the total dissipation, shown graphically in the datasheets of most CMOS circuits....