OEM ZIP DIP Sockets
• BeCu contacts assure continuity with very short path to P.C. trace • Contact design prevents solder bridging and wicking • Zero insertion/extraction force achieved with simple cam rotation using a screwdriver • For use where package field replacement or re-programming is required for DIP's • Socket contact point of .110" (2.79 mm) below top surface of socket • Pin counts available from 14 through 64 leads on .100" (2.54 mm) centers
www.DataSheet4U.com
Date Issued: November 1, 1999
9.
TS-0360-11 Sheet 1 of 2
Physical
Insulation Material: Flammability: Color: Marking: Contact Material: Plating Underplate: Wiping Area & Solder Tails: Optional Plating Underplate: Wiping Area & Solder Tails: Cam Material: Glass Filled Polyethermide ( PEI ) UL 94V-0 Black Raised Letters: Textool/3M Logo & Part Identification Beryllium Copper 75 m " [ 1.91 m m ] Copper – MIL-C-14550 250 m " [ 6.35 m m ] Tin – MIL-T -10727A 50 m " [ 1.27 m m ] Nickel Gold Flash Zinc
Electrical
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