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K2647 Dataheets PDF



Part Number K2647
Manufacturers Fuji Electric
Logo Fuji Electric
Description 2SK2647
Datasheet K2647 DatasheetK2647 Datasheet (PDF)

2SK2647-01MR FAP-IIS Series > Features High Speed Switching Low On-Resistance No Secondary Breakdown Low Driving Power High Voltage VGS = ± 30V Guarantee Repetitive Avalanche Rated N-channel MOS-FET 800V 4Ω 4A 40W > Outline Drawing > Applications - Switching Regulators - UPS - DC-DC converters www.DataSheet4U.com - General Purpose Power Amplifier > Maximum Ratings and Characteristics - Absolute Maximum Ratings T( C=25°C), unless otherwise specified > Equivalent Circuit Rating 800 4 16 ±3.

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2SK2647-01MR FAP-IIS Series > Features High Speed Switching Low On-Resistance No Secondary Breakdown Low Driving Power High Voltage VGS = ± 30V Guarantee Repetitive Avalanche Rated N-channel MOS-FET 800V 4Ω 4A 40W > Outline Drawing > Applications - Switching Regulators - UPS - DC-DC converters www.DataSheet4U.com - General Purpose Power Amplifier > Maximum Ratings and Characteristics - Absolute Maximum Ratings T( C=25°C), unless otherwise specified > Equivalent Circuit Rating 800 4 16 ±30 4 109 40 150 -55 ~ +150 Unit V A A V A mJ W °C °C Item Drain-Source-Voltage Continous Drain Current Pulsed Drain Current Gate-Source-Voltage Repetitive or Non-Repetitive (Tch ≤ 150°C) Avalanche Energy Max. Power Dissipation Operating and Storage Temperature Range Symbol V DS ID I D(puls) V GS I AR E AS PD T ch T stg - Electrical Characteristics (TC=25°C), Item Drain-Source Breakdown-Voltage Gate Threshhold Voltage Zero Gate Voltage Drain Current Gate Source Leakage Current Drain Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On-Time ton (ton=td(on)+tr) Turn-Off-Time toff (ton=td(off)+tf) Avalanche Capability Diode Forward On-Voltage Reverse Recovery Time Reverse Recovery Charge unless otherwise specified Symbol V (BR)DSS V GS(th) I DSS I R g C C C t t t t I V t Q GSS DS(on) fs iss oss rss d(on) r d(off) f AV SD rr rr Test conditions ID=1mA VGS =0V ID=1mA VDS= VGS VDS=800V Tch =25°C VGS=0V Tch=125°C VGS =±30V VDS=0V ID=2A VGS =10V ID=2A VDS=25V VDS=25V VGS =0V f=1MHz VCC=600V ID=4A VGS=10V RGS=10 Ω Tch =25°C L = 100µH IF=2xI DR VGS =0V T ch =25°C IF=IDR V GS =0V -dI F/dt=100A/µs T ch =25°C Min. 800 3,5 Typ. 4,0 10 0,2 10 3,19 2 450 75 40 20 40 50 25 1,0 450 3,0 Max. 4,5 500 1,0 100 4,0 3 Unit V V µA mA nA Ω S pF pF pF ns ns ns ns A V ns µC - Thermal Characteristics Item Thermal Resistance Symbol R th(ch-a) R th(ch-c) Test conditions channel to air channel to case Min. Typ. Max. 62,5 3,125 Unit °C/W °C/W Collmer Semiconductor - P.O. Box 702708 - Dallas TX - 75370 - 972.233.1589 - 972.233.0481 Fax - www.collmer.com - 11/98 N-channel MOS-FET 800V 4Ω 2SK2647-01MR FAP-IIS Series Drain-Source-On-State Resistance vs. Tch RDS(on) = f(Tch); ID=2A; VGS=10V 4A 40W > Characteristics Typical Output Characteristics ID=f(VDS); 80µs pulse test; TC=25°C Typical Transfer Characteristics ID=f(VGS); 80µs pulse test;VDS=25V; Tch=25°C ↑ ID [A] ↑ RDS(ON) [Ω] ↑ 2 ID [A] 1 3 www.DataSheet4U.com VDS [V] → Tch [°C] → VGS [V] → Typical Drain-Source-On-State-Resistance vs. ID RDS(on)=f(ID); 80µs pulse test; TC=25°C Typical Forward Transconductance vs. ID gfs=f(ID); 80µs pulse test; VDS=25V; Tch=25°C Gate Threshold Voltage vs. Tch VGS(th)=f(Tch); ID=1mA; VDS=VGS ↑ RDS(ON) [Ω] ↑ gfs [S] ↑ 5 VGS(th) [V] 4 6 ID [A] → ID [A] → Tch [°C] → Typical Capacitances vs. VDS C=f(VDS); VGS=0V; f=1MHz Avalanche Energy Derating Eas=f(starting Tch); VCC=80V; IAV=4A Forward Characteristics of Reverse Diode IF=f(VSD); 80µs pulse test; VGS=0V ↑ C [F] ↑ 7 Eas [mJ] ↑ 8 IF [A] 9 VDS [V] → Starting Tch [°C] → VSD [V] → Allowable Power Dissipation vs. TC PD=f(Tc) Safe operation area ID=f(VDS): D=0,01, Tc=25°C ↑ Zth(ch-c) [K/W] Transient Thermal impedance Zthch=f(t) parameter:D=t/T ↑ PD [W] 10 ↑ ID [A] 12 Tc [°C] → VDS [V] → t [s] → This specification is subject to change without notice! .


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