Chip LED
Semiconductor
SM2233
Chip LED
Features
• • • • Colorless diffusion lens type Compact type Radiation size 1.3mm × 2.9mm...
Description
Semiconductor
SM2233
Chip LED
Features
Colorless diffusion lens type Compact type Radiation size 1.3mm × 2.9mm Surface mount lead configuration
Outline Dimensions
www.DataSheet4U.com
unit : mm
2.40~2.60 1.20~1.40
2.80~3.00
1.80~2.00
0.50 Max.
0.90~1.10
0.10 Max.
0.20 Min.
0.50 Max.
1
2
PIN Connections 1. Anode 2. N.C. 3. Cathode
1 KSD-O8Q002-001 1
SM2233
Absolute Maximum Ratings
Characteristic
Power dissipation Forward current * Peak forward current Reverse voltage Operating temperature range Storage temperature range
2 1
(Ta=25oC)
Symbol
PD IF IFP VR Topr Tstg
Rating
63 25 50 4 -25∼80 -30∼100
Unit
mW mA mA V ℃ ℃
* Soldering temperature Tsol 240℃ for 10 seconds *1. Duty ratio = 1/16, Pulse width = 0.1ms *2. Recommended reflow soldering temperature profile - Preheating 150℃ to 185℃ within 120 seconds soldering 240℃ within 10 seconds www.DataSheet4U.com Gradual cooling (Avoid quenching) Temp (℃) 240 Peak Temp max. 240℃ Preheating area 150~185℃, 90±30sec 185 150 max. 3℃/sec max. 4℃/sec Time from 25℃ to Peak Temperature max. 6min 0 60 150 180 240 Time (sec) max. -6℃/sec max. 10sec
Solder area 220℃, max. 60sec
25
Electrical / Optical Characteristics
Characteristic
Forward voltage Luminous intensity Peak wavelength Spectrum bandwidth Reverse current
(Ta=25oC)
Symbol
VF IV
Test Condition
IF= 20mA IF= 20mA IF= 20mA IF= 20mA VR=4V IF= 20mA
Min
4 -
Typ.
2.1 570 30 ±55 ±80
Max.
2.5 10 -
Unit
V mcd nm nm uA deg
λP ∆λ IR
θ1/2
*3Half angle
*3. θ1/...
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