PROCESS
CPS150
Silicon Controlled Rectifier
25 Amp Sensitive Gate SCR Chip
PROCESS DETAILS Process Die Size Die Thickness Cathode Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization
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Glass Passivated Mesa 150 x 150 MILS 8.7 MILS 117 x 84 MILS 24 x 24 MILS Al - 45,000Å Al/Mo/Ni/Ag - 32,000Å
GEOMETRY
GRO...