MPC8360E

www.DataSheet4U.com Freescale Semiconductor Technical Data Document Number: MPC8360EEC Rev. 2, 12/2007 MPC8360E/MPC8358E PowerQUICC™ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications This document provides an overview of the MPC8360E/58E PowerQUICC™ II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networking, wireless infrastructure and telecommunications markets. Target applications include next generation DSLAMs, network interface cards for 3G basestations (Node Bs), routers, media gateways and high end IADs. The device extends current PowerQUICC II Pro offerings, adding higher CPU performance, additional functionality, faster interfaces and robust interworking between protocols while addressing the requirements related to time-to-market, price, power, and package size. This device can be used for the control plane along with data plane functionality. For functional characteristics of the processor, refer to the MPC8360E Integrated Communications Processor Family Reference Manual, Rev. 2. To locate any published errata or updates for this document, contact your Freescale sales office. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. Contents Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Electrical Character...