www.DataSheet4U.com
PROCESS
Small Signal Transistors
N - Channel Switch/Chopper J FET Chip
CP206
Central
TM
Semico...
www.DataSheet4U.com
PROCESS
Small Signal
Transistors
N - Channel Switch/Chopper J FET Chip
CP206
Central
TM
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Drain Bonding Pad Area Source Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 30,950 PRINCIPAL DEVICE TYPES 2N4391 2N4392 2N4393 CMPF4391 CMPF4392 CMPF4393 BACKSIDE GATE EPITAXIAL PLANAR 21 x 18 MILS 8.0 MILS 3.8 X 3.8 MILS 3.8 X 3.8 MILS 3.8 X 3.8 MILS Al - 30,000Å Au - 6,000Å
145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
R3 (9 -September 2003)
www.DataSheet4U.com
Central
TM
PROCESS
CP206
Semiconductor Corp.
Typical Electrical Characteristics
145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
R3 (9 -September 2003)
www.DataSheet4U.com
Central
TM
PROCESS
CP206
Semiconductor Corp.
Typical Electrical Characteristics
145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
R3 (9 -September 2003)
...