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FBGA-SD

Part Number	FBGA-SD
Manufacturer	STATS ChipPAC
Description	Fine Pitch Ball Grid Array
Published	Oct 17, 2007
Detailed Description	www.DataSheet4U.com FBGA-SD Fine Pitch Ball Grid Array - Stacked Die • FBGA-SD: Laminate substrate based enabling 2 & 4...
Datasheet	FBGA-SD PDF File

Overview

www.
DataSheet4U.
com FBGA-SD Fine Pitch Ball Grid Array - Stacked Die • FBGA-SD: Laminate substrate based enabling 2 & 4 layers of routing flexibility • FBGA-T-SD: Single metal layer tape based substrate with dense routing & good electrical performance • Available in 1.
4mm (LFBGA-SD), 1.
2mm (TFBGASD/TFBGA-T-SD), 1.
0mm (VFBGA-SD/VFBGA-TSD) & 0.
80mm (WFBGA-SD) maximum package thickness • Stacking of die allows for more functionality in an array molded, cost effective, space saving package solution FEATURES • 2 die to 7 die stack with spacer capability • 5 x 5mm to 23 x 23mm body size • Package height at 1.
0, 1.
2, 1.
4 and 1.
7mm max.
• Flexible die stacking options (“pyramid,” “same die,” etc.
)...

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FBGA-SD Fine Pitch Ball Grid Array - STATS ChipPAC

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