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FBGA

Part Number	FBGA
Manufacturer	STATS ChipPAC
Description	Fine Pitch Ball Grid Array
Published	Oct 17, 2007
Detailed Description	com FBGA Fine Pitch Ball Grid Array • Array molded, cost effective, space saving package solution • Ava...
Datasheet	FBGA PDF File

Overview

com FBGA Fine Pitch Ball Grid Array • Array molded, cost effective, space saving package solution • Available in 1.
40mm (LFBGA), 1.
20mm (TFBGA), and 1.
00mm (VFBGA), 0.
80mm (WFBGA) and 0.
55mm (UFBGA) maximum thickness • Laminate substrate based package which enables 2 and 4 layers of routing flexibility FEATURES • Thin, lightweight, space saving package • Flexible body sizes range from 4mm x 4mm to 23mm x 23mm • 0.
50, 0.
65, 0.
75, 0.
80, 1.
00mm ball pitch • Eutectic & Pb free solder balls • Green package available • Multiple routing layers and dedicated ground/power planes available for improved electrical performance • BT laminate materials (2 and 4 metal layers) • JEDEC stan...

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