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74HC3G07

NXP

Buffer

www.DataSheet4U.com INTEGRATED CIRCUITS DATA SHEET 74HC3G07; 74HCT3G07 Buffer with open-drain outputs Product specific...


NXP

74HC3G07

File Download Download 74HC3G07 Datasheet


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www.DataSheet4U.com INTEGRATED CIRCUITS DATA SHEET 74HC3G07; 74HCT3G07 Buffer with open-drain outputs Product specification 2003 Oct 15 www.DataSheet4U.com Philips Semiconductors Product specification Buffer with open-drain outputs FEATURES Wide supply voltage range from 2.0 to 6.0 V High noise immunity Low power dissipation ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. Multiple package options Specified from −40 to +85 °C and −40 to +125 °C. DESCRIPTION 74HC3G07; 74HCT3G07 The 74HC3G/HCT3G07 is a high-speed Si-gate CMOS device. Specified in compliance with JEDEC standard no. 7A. The 74HC3G/HCT3G07 provides three non-inverting buffers. The outputs of the 74HC3G/HCT3G07 devices are open drains and can be connected to other open-drain outputs to implement active-LOW, wired-OR or active-HIGH wired-AND functions. For digital operation this device must have a pull-up resistor to establish a logic HIGH-level. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C; tr = tf ≤ 6.0 ns. TYPICAL SYMBOL tPZL tPLZ CI CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + ∑ (CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; ∑ (CL × VCC2 × fo) = sum of outputs. 2. For 74HC3G07 the condition is VI = GND to VCC. For 74HCT3G07 the condition is VI = GND to VCC − 1...




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