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TB6581H/HG
TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP)
TB6581H/HG
3-Phase Fu...
www.DataSheet4U.com
TB6581H/HG
TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP)
TB6581H/HG
3-Phase Full-Wave Sine-Wave PWM Brushless Motor Controller
The TB6581H/HG is a high-voltage PWM BLDC motor driver. The product integrates the TB6551F/FG sine-wave controller and the TPD4103AK high-voltage driver in a single package (“2-in-1”). It is designed to change the speed of a BLDC directly motor by using a speed control signal (analog) from a microcontroller.
Features
A sine wave PWM drive controller and a high-voltage driver integrated in a single package. IGBTs arranged in three half-bridge units Triangle wave generator (carrier frequency = fosc/254 (Hz)) Dead-time insertion (1.9 µs) High-side bootstrap supply Bootstrap diode Overcurrent protection, thermal shutdown, and undervoltage lockout On-chip
regulator (Vreg = 7 V (typ.), 30 mA (max), Vrefout = 5 V (typ.), 30 mA (max)) Operating power supply voltage range: VCC = 13.5~16.5 V Motor power supply operating voltage range: VB = 50~400 V Weight: HZIP25-P-1.00K: 7.7 g (typ.)
TB6581HG: TB6581HG is a Pb-free product. The following conditions apply to solderability: *Solderability 1. Use of Sn-63Pb solder bath *solder bath temperature = 230˚C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245˚C *dipping time = 5 seconds *the number of times = once *use of R-type flux
1
2004-03-01
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