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SIGC68T170R3

Infineon Technologies
Part Number SIGC68T170R3
Manufacturer Infineon Technologies
Description IGBT
Published Sep 15, 2007
Detailed Description www.DataSheet4U.com SIGC68T170R3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • sho...
Datasheet PDF File SIGC68T170R3 PDF File

SIGC68T170R3
SIGC68T170R3

Overview
www.
DataSheet4U.
com SIGC68T170R3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling 3 This chip is used for: • power module C Applications: • drives G E Chip Type SIGC68T170R3 VCE 1700V ICn 50A Die Size 8.
23 x 8.
25 mm2 Package sawn on foil Ordering Code Q67050A4147-A001 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Emitter metalization Collector metalization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 8.
23 x 8.
25 4 x ( 2.
94 x ...


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