BAP50-02

BAP50-02 General purpose PIN diode Rev. 3 — 26 November 2018 Product data sheet 1 Product profile 1.1 General description General-purpose PIN diode in an SOD523 small SMD plastic package. 1.2 Features and benefits Low diode capacitance Low diode forward resistance 1.3 Applications General RF applications NXP Semiconductors BAP50-02 General purpose PIN diode 2 Pinning information Table 1. Discrete pinning Pin Description 1 cathode 2 anode Simplified outline Graphic symbol 1 2 sym006 Top view 3 Ordering information Table 2. Ordering information Type number Package Name Description BAP50-02 - plastic surface-mounted package; 2 leads 4 Marking Table 3. Marking code Type number BAP50-02 Marking code K4 5 Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min VR continuous forward - voltage IF continuous forward - current Ptot total power dissipation Tsp ≤ 90 °C - Tstg storage temperature -65 Tj junction temperature -65 6 Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Rth(j-sp) thermal resistance from junction to solder point Conditions Version SOD523 Max Unit 50 V 50 mA 715 mW +150 °C +150 °C Typ Unit 85 K/W BAP50-02 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 November 2018 © NXP B.V. 2018. All rights reserved. 2/9 NXP Semiconductors B...