0.5W POWER PHEMT • FEATURES ♦ 27 dBm Output Power at 1-dB Compression at 18 GHz ♦ 9.5 dB Power Gain at 18 GHz ♦ 55% Powe...
0.5W POWER PHEMT FEATURES ♦ 27 dBm Output Power at 1-dB Compression at 18 GHz ♦ 9.5 dB Power Gain at 18 GHz ♦ 55% Power-Added Efficiency
DRAIN BOND PAD (2X) SOURCE BOND PAD (2x)
LP6872
GATE BOND PAD (2X)
DESCRIPTION AND APPLICATIONS
DIE SIZE: 14.6X19.7 mils (370x500 µm) DIE THICKNESS: 3.0 mils (75 µm) BONDING PADS: 1.9X2.4 mils (50x60 µm)
The LP6872 is an Aluminum Gallium Arsenide / Indium Gallium Arsenide (AlGaAs/InGaAs) Pseudomorphic High Electron Mobility
Transistor (PHEMT), utilizing an Electron-Beam directwrite 0.25 µ m by 720 µ m
Schottky barrier gate. The recessed “mushroom” gate structure minimizes parasitic gate-source and gate resistances. The epitaxial structure and processing have been optimized for reliable high-power applications. The LP6872 also features Si3 N4 passivation. Typical applications include commercial wireless infrastructure amplifiers, such as SATCOM uplink transmitters, PCS/Cellular low-voltage high-efficiency output amplifiers, and medium-haul digital radio transmitters. ELECTRICAL SPECIFICATIONS @ TAmbient = 25 ° C
Parameter Saturated Drain-Source Current Power at 1-dB Compression Power Gain at 1-dB Compression Power-Added Efficiency Maximum Drain-Source Current Transconductance Gate-Source Leakage Current Pinch-Off Voltage Gate-Source Breakdown Voltage Magnitude Gate-Drain Breakdown Voltage Magnitude Thermal Resistivity frequency=18 GHz Symbol IDSS P-1dB G-1dB PAE IMAX GM IGSO VP |VBDGS| |VBDGD| ΘJC Test Conditions VDS = 2 V; VGS = ...
