SY2333

Semiconductor SY2333 Chip LED Features Colorless transparency lens type Compact type Radiation size 1.3 ㎜×2.9 ㎜ Surface mount lead configuration Outline Dimensions unit : mm 2.40~2.60 1.20~1.40 www.DataSheet4U.com 2.80~3.00 1.80~2.00 0.50 Max. 0.90~1.10 0.10 Max. 0.20 Min. 0.50 Max. 1 2 PIN Connections 1. Anode 2. N.C. 3. Cathode 1 KSD-O8Q004-001 1 SY2333 Absolute Maximum Ratings Characteristic Power dissipation Forward current * Peak forward current Reverse voltage Operating temperature range Storage temperature range 2 1 (Ta=25oC) Symbol PD IF IFP VR Topr Tstg Ratings 63 25 50 4 -25∼80 -30∼100 Unit mW mA mA V ℃ ℃ * Soldering temperature Tsol 240℃ for 10 seconds *1. Duty ratio = 1/16, Pulse width = 0.1ms *2. Recommended reflow soldering temperature profile - Preheating 150℃ to 185℃ within 120 seconds soldering 240℃ within 10 seconds Gradual cooling (Avoid quenching) Temp (℃) 240 Peak Temp max. 240℃ Preheating area 150~185℃, 90±30sec 185 www.DataSheet4U.com max. 10sec Solder area 220℃, max. 60sec max. 3℃/sec max. -6℃/sec 150 max. 4℃/sec Time from 25℃ to Peak Temperature max. 6min 0 60 150 180 240 Time (sec) 25 Electrical / Optical Characteristics Characteristic Forward voltage Luminous intensity Peak wavelength Spectrum bandwidth Reverse current (Ta=25oC) Symbol VF IV Test Condition IF= 20mA IF= 20mA IF= 20mA IF= 20mA VR=4V Min 2 - Typ. 2.1 585 30 ±55 ±70 Max. 2.5 10 - Unit V mcd nm nm uA deg λP ∆λ IR θ1/2 X Y *3Half angle IF= 20...