Document
CYStech Electronics Corp.
100V/100mA SURFACE MOUNT SWITCHING DIODE
Spec. No. : C332SG Issued Date : 2004.03.26 Revised Date : Page No. : 1/3
CASD355SG
Features:
● Small surface mounting type ● High reliability ● High speed(trr<4ns)
Mechanical data:
● Case: Molded plastic, JEDEC SOD-323 ● Terminals : Solder plated, solderable per MIL-STD-750, method 2026. ● Polarity: Indicated by cathode band ● Mounting position: Any ● Weight: 0.000159 ounce, 0.0045 gram
Absolute Maximum Ratings(At Ta=25℃, unless otherwise noted)
www.DataSheet4U.com
Characteristics Repetitive Peak Reverse Voltage Average Forward Current, VR=0 Peak Forward Surge Current, tp<1s Power Dissipation Junction Temperature Storage Temperature Range
Symbol VRRM IFAV IFSM PD Tj Tstg
Value 100 100 500 350 175 -55 to +175
Unit V mA mA mW °C °C
Electrical Characteristics ( At Ta=25°C, unless otherwise noted)
Parameter Forward Voltage Reverse Current Breakdown Voltage Diode Capacitance Reverse Recovery Time Conditions IF=10mA VR=25V VR=25V, Tj=150℃ VR=80V IR=100µA, Tp/T=0.01, Tp=0.3ms VR=0, f=1MHz, VHF=50mV IF=10mA,VR=6V,IRR=0.1×IR, RL=100Ω Symbol VF IR IR IR V(BR) CD trr Min 100 Typ Max 1.2 100 50 30 4 4 Unit V nA µA µA V pF ns
CASD355SG
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Reverse Leakage Current vs Junction Temperature
1000 Reverse Leakage Current---I R(μA)
VR =80V / Max. Values
Spec. No. : C332SG Issued Date : 2004.03.26 Revised Date : Page No. : 2/3
Forward Current vs Forward Voltage
1000 Instantaneous Forward Current---I F(mA)
Tj=25℃ Pulse Width 300μs 1% Duty Cycle
100
100
10 1
VR =80V / Typ Values
10
Scattering Limit
0.1
VR =25V / Typ. Values
1
0.01 0 20 40 60 80 100 120 140 160 180 200 Junction Temperature---Tj(℃)
0.1 0 0.4 0.8 1.2 1.6 2 Forward Voltage---VF(V)
Reverse Leakage Current vs Reverse Voltage
1000 3 Tj= 25℃ 100 Scattering Limit 10
Capacitance vs Reverse Voltage
Reverse Leakage Current---I R(nA)
Diode Capacitance ---C D(pF)
2.5
f=1MHz Ta=25℃
2
1.5
1
1 1 10 100
0.5 0.1 1 10 100
Reverse Voltage---VR(V)
Reverse Voltage---VR(V)
CASD355SG
CYStek Product Specification
CYStech Electronics Corp.
SOD-323F Dimension
Spec. No. : C332SG Issued Date : 2004.03.26 Revised Date : Page No. : 3/3
SOD-323F Plastic Surface Mounted Package CYStek Package Code:SG
*:Typical
DIM A B C
Inches Min. Max. 0.090 0.106 0.045 0.053 0.012(typ)
Millimeters Min. Max. 2.3 2.7 1.15 1.35 0.3(typ)
DIM D R
Inches Min. Max. 0.028 0.035 0.02(typ)
Millimeters Min. Max. 0.7 0.9 0.5(typ)
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CASD355SG
CYStek Product Specification
.