Document
Am41DL32x8G
Data Sheet
July 2003 The following document specifies Spansion memory products that are now offered by both Advanced Micro Devices and Fujitsu. Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any changes that have been made are the result of normal datasheet improvement and are noted in the document revision summary, where supported. Future routine revisions will occur when appropriate, and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order these products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion memory solutions.
Publication Number 25558 Revision A
Amendment +1 Issue Date September 5, 2002
PRELIMINARY
Am41DL32x8G
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory and 8 Mbit (1 M x 8-Bit/512 K x 16-Bit) Static RAM DISTINCTIVE CHARACTERISTICS MCP Features
s Power supply voltage of 2.7 to 3.3 volt s High performance
— Access time as fast as 70 ns
SOFTWARE FEATURES
s Data Management Software (DMS)
— AMD-supplied software manages data programming and erasing, enabling EEPROM emulation — Eases sector erase limitations
s Package
— 73-Ball FBGA
s Supports Common Flash Memory Interface (CFI) s Erase Suspend/Erase Resume
— Suspends erase operations to allow programming in same bank
s Operating Temperature
— –40°C to +85°C
Flash Memory Features
ARCHITECTURAL ADVANTAGES
s Simultaneous Read/Write operations
— Data can be continuously read from one bank while executing erase/program functions in other bank — Zero latency between read and write operations
s Data# Polling and Toggle Bits
— Provides a software method of detecting the status of program or erase cycles
s Unlock Bypass Program command
— Reduces overall programming time when issuing multiple program command sequences
HARDWARE FEATURES
s Any combination of sectors can be erased s Ready/Busy# output (RY/BY#)
— Hardware method for detecting program or erase cycle completion
s Secured Silicon (SecSi) Sector: Extra 256 Byte sector
— Factory locked and identifiable: 16 bytes available for secure, random factory Electronic Serial Number; verifiable as factory locked through autoselect function. — Customer lockable: Sector is one-time programmable. Once locked, data cannot be changed
s Hardware reset pin (RESET#)
— Hardware method of resetting the internal state machine to reading array data
s Zero Power Operation
— Sophisticated power management circuits reduce power.