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ZXTP2025F Dataheets PDF



Part Number ZXTP2025F
Manufacturers Zetex Semiconductors
Logo Zetex Semiconductors
Description PNP medium power transistor
Datasheet ZXTP2025F DatasheetZXTP2025F Datasheet (PDF)

ZXTP2025F 50V, SOT23, PNP medium power transistor Summary V(BR)CEO > -50V IC(cont) = -5A RCE(sat) = 30m⍀ typical VCE(sat) < - 60mV @ -1A PD = 1.2W Complementary part number: ZXTN2031F Description Advanced process capability and package design have been used to maximize the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally suited to applications where space is at a premium. Features • • • • • Higher power dissipation SOT.

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ZXTP2025F 50V, SOT23, PNP medium power transistor Summary V(BR)CEO > -50V IC(cont) = -5A RCE(sat) = 30m⍀ typical VCE(sat) < - 60mV @ -1A PD = 1.2W Complementary part number: ZXTN2031F Description Advanced process capability and package design have been used to maximize the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally suited to applications where space is at a premium. Features • • • • • Higher power dissipation SOT23 package High peak current Low saturation voltage High gain 50V forward blocking voltage Applications • • • • • MOSFET and IGBT gate driving Motor drive Relay, lamp and solenoid drive High side switches DC-DC converters Pinout - top view Ordering information Device ZXTP2025FTA Reel size (inches) 7 Tape width (mm) 8 Quantity per reel 3,000 Device marking 312 Issue 3 - January 2006 © Zetex Semiconductors plc 2006 1 www.zetex.com ZXTP2025F Absolute maximum ratings Parameter Collector-base voltage Collector-emitter voltage Emitter-base voltage Peak pulse current Continuous collector current (c) Base current Power dissipation @ TA=25°C (a) Linear derating factor Power dissipation @ TA=25°C (b) Linear derating factor Power dissipation @ TA=25°C (c) Linear derating factor Operating and storage temperature Symbol VCBO VCEO VEBO ICM IC IB PD PD PD Tj:Tstg Limit -50 -50 -7.0 -10 -5 -1.2 1.0 8.0 1.2 9.6 1.56 12.5 -55 to +150 Unit V V V A A A W mW/°C W mW/°C W mW/°C °C Thermal resistance Parameter Junction to ambient (a) Junction to ambient (b) Junction to ambient (c) Symbol RθJA RθJA RθJA Value 125 104 80 Unit °C/W °C/W °C/W NOTES: (a) Mounted on 18mm x 18mm x 1.6mm FR4 PCB with a very high coverage of 2 oz weight copper in still air conditions. (b) Mounted on 30mm x 30mm x 1.6mm FR4 PCB with a very high coverage of 2 oz weight copper in still air conditions. (c) As (b) above measured at t<5secs. Issue 3 - January 2006 © Zetex Semiconductors plc 2006 2 www.zetex.com ZXTP2025F Characteristics Issue 3 - January 2006 © Zetex Semiconductors plc 2006 3 www.zetex.com ZXTP2025F Electrical characteristics (at Tamb = 25°C unless otherwise stated) Parameter Collector-base breakdown voltage Collector-emitter breakdown voltage Emitter-base breakdown voltage Collector-emitter cut-off current Collector-base cut-off current Emitter-base cut-off current Static forward current transfer ratio Symbol V(BR)CBO V(BR)CEO V(BR)EBO ICEV ICBO IEBO HFE 180 200 70 12 Collector-emitter saturation voltage VCE(sat) 380 350 120 30 -11 -40 -150 -150 Base-emitter saturation voltage Base-emitter turn-on voltage Transition frequency Output capacitance Delay time Rise time Storage time Fall time VBE(sat) -0.81 -0.95 VBE(on) fT Cobo t(d) t(r) t(stg) t(f) -0.82 190 42 14 23 240 30 -20 -60 -230 -200 -0.88 -1.05 -0.92 mV mV mV mV V V V MHz pF ns ns ns ns VCC=-12V, IC=-2.5A, IB1=IB2=-125mA 560 Min. -50 -50 -7.0 Typ. 100 70 8.5 -20 -20 -10 Max. Unit V V V nA nA nA Conditions IC=-100µA IC=-10mA (a) IE=-100µA VCE=-40V, VBE = 1V VCB=-40V VEB=-6V IC=-10mA, VCE=-2V(a) IC=-500mA, VCE=-2V(a) Ic=-5A, VCE=-2V(a) Ic=-10A, VCE=-2V(a) IC=-100mA, IB=-10mA(a) IC=-1A, IB=-100mA(a) IC=-2A, IB=-40mA(a) IC=-5A, IB=-500mA(a) IC=-2A, IB=-40mA(a) IC=-5A, IB=-500mA(a) IC=-5A, VCE=-2V(a) Ic=-500mA, VCE=-10V, f=50MHz VCB=-10V, f=1MHz NOTES: (a) Measured under pulsed conditions. Pulse width=300␮S. Duty cycle Յ2%. Issue 3 - January 2006 © Zetex Semiconductors plc 2006 4 www.zetex.com ZXTP2025F Typical characteristics Issue 3 - January 2006 © Zetex Semiconductors plc 2006 5 www.zetex.com ZXTP2025F Packaging details - SOT23 L H N D 3 leads G M B A C K F Dim. A B C D F G Millimeters Min. 2.67 1.20 0.37 0.085 Max. 3.05 1.40 1.10 0.53 0.15 Inches Min. 0.105 0.047 0.015 0.0034 Max. 0.120 0.055 0.043 0.021 0.0059 Dim. H K L M N - Millimeters Min. 0.33 0.01 2.10 0.45 Max. 0.51 0.10 2.50 0.64 - Inches Max. 0.013 0.0004 0.083 0.018 Max. 0.020 0.004 0.0985 0.025 - 0.95 NOM 0.0375 NOM 1.90 NOM 0.075 NOM Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Europe Zetex GmbH Streitfeldstraße 19 D-81673 München Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 [email protected] Americas Zetex Inc 700 Veterans Memorial Highway Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 [email protected] Asia Pacific Zetex (Asia Ltd) 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 [email protected] Corporate Headquarters Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom Telephone: (44) 161 622 4444 Fax: (44) 161 622 4446 [email protected] For international sales offices visit www.zetex.com/offices Zetex products are distributed worldwide. For details, see www.zetex.com/salesnetwork This publication is issued to provide outline information only which (unless agreed by the company in writing).


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