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MAX8805Z Dataheets PDF



Part Number MAX8805Z
Manufacturers Maxim Integrated Products
Logo Maxim Integrated Products
Description PWM Step-Down Converters
Datasheet MAX8805Z DatasheetMAX8805Z Datasheet (PDF)

19-0777; Rev 0; 4/07 600mA PWM Step-Down Converters in 2mm x 2mm WLP for WCDMA PA Power General Description The MAX8805Y/MAX8805Z high-frequency step-down converters are optimized for dynamically powering the power amplifier (PA) in WCDMA or NCDMA handsets. The devices integrate a high-efficiency PWM step-down converter for medium- and low-power transmission, and a 60mΩ typical bypass FET to power the PA directly from the battery during high-power transmission. Dual 200mA low-noise, high-PSRR l.

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19-0777; Rev 0; 4/07 600mA PWM Step-Down Converters in 2mm x 2mm WLP for WCDMA PA Power General Description The MAX8805Y/MAX8805Z high-frequency step-down converters are optimized for dynamically powering the power amplifier (PA) in WCDMA or NCDMA handsets. The devices integrate a high-efficiency PWM step-down converter for medium- and low-power transmission, and a 60mΩ typical bypass FET to power the PA directly from the battery during high-power transmission. Dual 200mA low-noise, high-PSRR low-dropout regulators (LDOs) for PA biasing are also integrated. Two switching frequency options are available—2MHz (MAX8805Y) and 4MHz (MAX8805Z)—allowing optimization for smallest solution size or highest efficiency. Fast switching allows the use of small ceramic 2.2µF input and output capacitors while maintaining low ripple voltage. The feedback network is integrated, further reducing external component count and total solution size. The MAX8805Y/MAX8805Z use an analog input driven by an external DAC to control the output voltage linearly for continuous PA power adjustment. At high duty cycle, the MAX8805Y/MAX8805Z automatically switch to the bypass mode, connecting the input to the output through a low-impedance (60mΩ typ) MOSFET. The www.DataSheet4U.com user can also enable the bypass mode directly through a logic-control input. The LDOs in the MAX8805Y/MAX8805Z are designed for low-noise operation (35µVRMS typ). Each LDO is individually enabled through its own logic control interface. The MAX8805Y/MAX8805Z are available in a 16-bump, 2mm x 2mm WLP package (0.7mm max height). Features ♦ PA Step-Down Converter 7.5µs (typ) Settling Time for 0.8V to 3.4V Output Voltage Change Dynamic Output Voltage Setting from 0.4V to VBATT 60mΩ pFET and 100% Duty Cycle for Low Dropout 2MHz or 4MHz Switching Frequency Low Output-Voltage Ripple 600mA Output Drive Capability 2% Maximum Accuracy Tiny External Components ♦ Dual Low-Noise LDOs Low 35µVRMS (typ) Output Noise High 70dB (typ) PSRR Guaranteed 200mA Output Drive Capability Individual ON/OFF Control ♦ Low 0.1µA Shutdown Current ♦ 2.7V to 5.5V Supply Voltage Range ♦ Thermal Shutdown ♦ Tiny 2mm x 2mm x 0.7mm WLP Package (4 x 4 Grid) MAX8805Y/MAX8805Z Typical Operating Circuit BATT 2.7V TO 5.5V IN1A 2.2μF IN1B PAA PAB LX 1μH VPA 0.4V TO VBATT Applications WCDMA/NCDMA Cellular Handsets Wireless PDAs Smartphones MAX8805Z PA ON/OFF PA_EN REFIN HP EN1 EN2 AGND LDO1 PGND REFBP 2.2μF Ordering Information PART PINPACKAGE PKG CODE W162B2+1 W162B2+1 SWITCHING FREQUENCY (MHz) 2 4 ANALOG CONTROL FORCED BYPASS LDO1 ON/OFF LDO2 ON/OFF BATT 2.7V TO 5.5V VLDO1 UP TO 200mA MAX8805YEWExy+T* 16 WLP-16 MAX8805ZEWExy+T* 16 WLP-16 IN2 LDO2 +Denotes a lead-free package. T = Tape and reel package. *xy is the output voltage code (see Table 1 in the Output Voltages section). VLDO2 UP TO 200mA Note: All devices are specified over the -40°C to +85°C operating temperature range. Pin Configuration appears at end of data sheet. 1 ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 600mA PWM Step-Down Converters in 2mm x 2mm WLP for WCDMA PA Power MAX8805Y/MAX8805Z ABSOLUTE MAXIMUM RATINGS IN1A, IN1B, IN2, REFIN, EN2, REFBP to AGND ...-0.3V to +6.0V PAA, PAB, PA_EN, HP to AGND....-0.3V to (VIN1A/VIN1B + 0.3V) LDO1, LDO2, EN1 to AGND ......................-0.3V to (VIN2 + 0.3V) IN2 to IN1B/IN1A ...................................................-0.3V to +0.3V PGND to AGND .....................................................-0.3V to +0.3V LX Current ......................................................................0.7ARMS IN1A/IN1B and PAA/PAB Current .....................................2ARMS PAA and PAB Short Circuit to GND or IN...................Continuous Continuous Power Dissipation (TA = +70°C) 16-Bump WLP (derate 12.5mW/°C above +70°C).............1W Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Bump Temperature (soldering, reflow) ............................+235°C Note: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposur.


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