ESD4-LFC

05210 ESD4-LFC LOW CAPACITANCE FLIP CHIP ARRAY APPLICATIONS ✔ Cellular Phones ✔ I/O Ports ✔ Notebooks & Pocket PCs ✔ Personal Digital Assistant (PDA) ✔ Ground Positioning System (GPS) ✔ SMART Cards IEC COMPATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns 5 BUMP FLIP CHIP FEATURES ✔ ESD Protection > 25 kilovolts ✔ Unidirectional Configuration ✔ Low Capacitance: 15pF ✔ Protects Up to Four(4) Data Lines ✔ RoHS Compliant MECHANICAL CHARACTERISTICS ✔ 5 Bump Flip Chip Package ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Lead-Free Plating ✔ Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Consult Factory for Leaded Device Availability ✔ Flammability Rating UL 94V-0 ✔ 8mm Tape and Reel Per EIA Standard 481 PIN CONFIGURATION G1 05210.R3 2/07 1 www.protekdevices.com ESD4-LFC DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER Operating Temperature Storage Temperature DC Power Rating SYMBOL TA TSTG P VALUE -40 to 85 -55 to 150 200 UNITS °C °C mW ELECTRICAL CHARACTERISTICS PER LINE PART NUMBER RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM LEAKAGE CURRENT @ 25°C Unless Otherwise Specified TYPICAL FORWARD VOLTAGE MAXIMUM CLAMPING VOLTAGE TYPICAL CAPACITANCE PER LINE (See Note 1) @2.5V, 1 MHz C pF V WM VOLTS @ 1mA V(BR) VOLTS @3.3V ID µA @ 10mA VF VOLTS @ IP = 10mA VC VOLTS ESD4-LFC Note 1: ±20% tolerance. 5.0 6.0 0.1 0.8 8 15 1.6 Cj - Ca...