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RMPA2266

Fairchild Semiconductor

WCDMA Band I Power Amplifier Module

PRELIMINARY RMPA2266 i-Lo™ WCDMA Band I Power Amplifier Module April 2007 RMPA2266 i-Lo™ WCDMA Band I Power Amplifier M...


Fairchild Semiconductor

RMPA2266

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Description
PRELIMINARY RMPA2266 i-Lo™ WCDMA Band I Power Amplifier Module April 2007 RMPA2266 i-Lo™ WCDMA Band I Power Amplifier Module Features ■ 40% WCDMA efficiency at +28dBm Pout ■ 20% WCDMA efficiency (58mA total current) at ■ ■ ■ ■ tm General Description ■ ■ ■ The RMPA2266 Power Amplifier Module (PAM) is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA +16dBm Pout applications. Answering the call for ultra-low DC power Low quiescent current (Iccq): 25mA in low-power consumption and extended battery life in portable mode electronics, the RMPA2266 uses novel proprietary Meets UMTS/WCDMA performance requirements circuitry to dramatically reduce amplifier current at low to Meets HSDPA performance requirements medium RF output power levels (< +16dBm), where the Single positive-supply operation with low power and handset most often operates. A simple two-state Vmode shutdown modes control is all that is needed to reduce operating current by more than 60% at 16dBm output power, and – 3.4V typical Vcc operation quiescent current (Iccq) by as much as 70% compared – Low Vref (2.85V) compatible with advanced handset to traditional power-saving methods. No additional chipsets circuitry, such as DC-to-DC converters, are required to Compact Lead-free compliant LCC package – achieve this remarkable improvement in amplifier (4.0 x 4.0 x 1.0mm nominal) efficiency. Further, the 4 x 4 x 1.0mm LCC package is Industry standard pinout pin-compatible and a dr...




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