MICROWAVE POWER GaAs FET
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MICROWAVE POWER GaAs FET MICROWAVE SEMICONDUCTOR
TIM6472-8UL
TECHNICAL DATA FEATURES
n HIGH POWER...
Description
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MICROWAVE POWER GaAs FET MICROWAVE SEMICONDUCTOR
TIM6472-8UL
TECHNICAL DATA FEATURES
n HIGH POWER P1dB=39.5dBm at 6.4GHz to 7.2GHz n HIGH GAIN G1dB= 9.5dB at 6.4GHz to 7.2GHz n BROAD BAND INTERNALLY MATCHED FET n HERMETICALLY SEALED PACKAGE
RF PERFORMANCE SPECIFICATIONS ( Ta= 25°C )
CHARACTERISTICS Output Power at 1dB Gain Compression Point Power Gain at 1dB Gain Compression Point Drain Current Gain Flatness Power Added Efficiency 3rd Order Intermodulation Distortion Drain Current Channel Temperature Rise IDS2 ∆Tch IDS1 ∆G G1dB VDS= 10V dB A dB % Two-Tone Test Po= 28.5dBm
(Single Carrier Level)
(VDS X IDS + Pin – P1dB) X Rth(c-c)
SYMBOL P1dB
CONDITIONS
UNIT dBm
MIN. 38.5 8.5 -44
TYP. MAX. 39.5 9.5 2.2 36 -47 2.2 2.6 ±0.6 2.6 80
f = 6.4 to 7.2GHz
ηadd
IM3
dBc A °C
Recommended gate resistance(Rg) : Rg= 150 Ω(MAX.)
ELECTRICAL CHARACTERISTICS ( Ta= 25°C )
CHARACTERISTICS Transconductance Pinch-off Voltage Saturated Drain Current Gate-Source Breakdown Voltage Thermal Resistance SYMBOL
gm
VGSoff IDSS VGSO
CONDITIONS VDS= 3V IDS= 3.0A VDS= 3V IDS= 30mA VDS= 3V VGS= 0V IGS= -100µA
UNIT mS V A V °C/W
MIN. -1.0 -5
TYP. MAX. 1800 -2.5 5.2 2.5 -4.0 3.5
Rth(c-c) Channel to Case
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