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TIM6472-8UL

Toshiba Semiconductor

MICROWAVE POWER GaAs FET

www.DataSheet4U.com MICROWAVE POWER GaAs FET MICROWAVE SEMICONDUCTOR TIM6472-8UL TECHNICAL DATA FEATURES n HIGH POWER...


Toshiba Semiconductor

TIM6472-8UL

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www.DataSheet4U.com MICROWAVE POWER GaAs FET MICROWAVE SEMICONDUCTOR TIM6472-8UL TECHNICAL DATA FEATURES n HIGH POWER P1dB=39.5dBm at 6.4GHz to 7.2GHz n HIGH GAIN G1dB= 9.5dB at 6.4GHz to 7.2GHz n BROAD BAND INTERNALLY MATCHED FET n HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS ( Ta= 25°C ) CHARACTERISTICS Output Power at 1dB Gain Compression Point Power Gain at 1dB Gain Compression Point Drain Current Gain Flatness Power Added Efficiency 3rd Order Intermodulation Distortion Drain Current Channel Temperature Rise IDS2 ∆Tch IDS1 ∆G G1dB VDS= 10V dB A dB % Two-Tone Test Po= 28.5dBm (Single Carrier Level) (VDS X IDS + Pin – P1dB) X Rth(c-c) SYMBOL P1dB CONDITIONS UNIT dBm MIN. 38.5 8.5    -44   TYP. MAX. 39.5 9.5 2.2  36 -47 2.2    2.6 ±0.6   2.6 80 f = 6.4 to 7.2GHz ηadd IM3 dBc A °C Recommended gate resistance(Rg) : Rg= 150 Ω(MAX.) ELECTRICAL CHARACTERISTICS ( Ta= 25°C ) CHARACTERISTICS Transconductance Pinch-off Voltage Saturated Drain Current Gate-Source Breakdown Voltage Thermal Resistance SYMBOL gm VGSoff IDSS VGSO CONDITIONS VDS= 3V IDS= 3.0A VDS= 3V IDS= 30mA VDS= 3V VGS= 0V IGS= -100µA UNIT mS V A V °C/W MIN.  -1.0  -5  TYP. MAX. 1800  -2.5 5.2  2.5 -4.0   3.5 Rth(c-c) Channel to Case u The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its ...




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