Soft Recovery Diode
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PD -2.462 rev. A 03/99
HFA60MB60C
HEXFRED
Features
Reduced RFI and EMI Reduced Snubbing Exte...
Description
www.DataSheet4U.com
PD -2.462 rev. A 03/99
HFA60MB60C
HEXFRED
Features
Reduced RFI and EMI Reduced Snubbing Extensive Characterization of Recovery Parameters
TM
Ultrafast, Soft Recovery Diode
(ISOLATED BASE)
(1-3)
ANODE 1
(4-6)
(7-9)
ANODE 2
COMMON CATHODE
VR = 600V VF(typ.) = 1.1V IF(AV) = 60A Qrr (typ.) = 200nC IRRM(typ.) = 6A trr(typ.) = 30ns di(rec)M/dt (typ.) = 170A/µs
Description
HEXFRED diodes are optimized to reduce losses and EMI/RFI in high frequency power conditioning systems. An extensive characterization of the recovery behavior for different values of current, temperature and di/dt simplifies the calculations of losses in the operating conditions. The softness of the recovery eliminates the need for a snubber in most applications. These devices are ideally suited for power converters, motors drives and other applications where switching losses are significant portion of the total losses.
TM
Absolute Maximum Ratings (per Leg)
Parameter
VR IF @ TC = 25°C IF @ TC = 100°C IFSM EAS PD @ TC = 25°C PD @ TC = 100°C TJ TSTG Cathode-to-Anode Voltage Continuous Forward Current Continuous Forward Current Single Pulse Forward Current Non-Repetitive Avalanche Energy Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Temperature, for 10 sec.
D-60 (MODIFIED T0-249AA)
Max.
600 50 24 200 220 125 50 -55 to +150
A
Units
V A µJ W °C
300 (0.063 in. (1.6mm) from case)
Thermal - Mechanical Characteri...
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