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CS1089 Dataheets PDF



Part Number CS1089
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description Vacuum Fluorescent Display Tube Driver
Datasheet CS1089 DatasheetCS1089 Datasheet (PDF)

www.DataSheet4U.com CS1089 Vacuum Fluorescent Display Tube Driver The VFD Driver is a microprocessor interface IC that drives a multiplexed VF (Vacuum Fluorescent) display tube. It consists of a 32–bit shift register, a 32–bit transparent data latch, a metal mask ROM, six 20 mA anode output drivers, twenty–three 2 mA anode output drivers, and three 50 mA grid drivers with output enables. Features Power On Reset Display Dimming Possible Three, 50 mA Grid Drivers Anodes: – 6 @ 20 mA – 23 @ 2 mA h.

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www.DataSheet4U.com CS1089 Vacuum Fluorescent Display Tube Driver The VFD Driver is a microprocessor interface IC that drives a multiplexed VF (Vacuum Fluorescent) display tube. It consists of a 32–bit shift register, a 32–bit transparent data latch, a metal mask ROM, six 20 mA anode output drivers, twenty–three 2 mA anode output drivers, and three 50 mA grid drivers with output enables. Features Power On Reset Display Dimming Possible Three, 50 mA Grid Drivers Anodes: – 6 @ 20 mA – 23 @ 2 mA http://onsemi.com • • • • DIP–40 WIDE BODY N SUFFIX CASE 711 40 1 PLCC–44 FN SUFFIX CASE 777 Chip Select VIGN 12 V Clock Regulator 5V GND ORDERING INFORMATION Data Out SPI Functions Device CS1089XN40 Package DIP–40 WIDE BODY PLCC–44 PLCC–44 Shipping 9 Units/Rail 23 Units/Rail 500 Tape & Reel Anodes 1:29 0.1 µF VCC µP PORT PORT PORT GND PORT VBB FILAMENT VFD GRID1GRID2 GRID3 GND CS1089XFN44 CS1089XFNR44 VBAT CS1089 DOUT DIN GRID1 CLK GRID2 STB GRID3 GREN GND DEVICE MARKING INFORMATION See general marking information in the device marking section on page 7 of this data sheet. Figure 1. Application Diagram © Semiconductor Components Industries, LLC, 2001 1 August, 2001 – Rev. 9 Publication Order Number: CS1089/D CS1089 MAXIMUM RATINGS* Parameter Supply Voltage (VBB) Input Voltages (DIN, CLK, STB, GREN) Junction Temperature Range Storage Temperature Range ESD Susceptibility (Human Body Model) ESD Susceptibility (Machine Model) Package Thermal Resistance, DIP–40 Junction–to–Case, RθJC Junction–to–Ambient, RθJA Package Thermal Resistance, PLCC–44 Junction–to–Case, RθJC Junction–to–Ambient, RθJA Lead Temperature Soldering: 1. 10 second maximum. 2. 60 second maximum above 183°C. *The maximum package power dissipation must be observed. Wave Solder (through hole styles only) Note 1 Reflow (SMD styles only) Note 2 Value –0.6 to +18 –0.6 to +6.0 –40 to +150 –55 to +150 2.0 200 20 45 16 55 260 Peak 230 Peak Unit V V °C °C kV V °C/W °C/W °C/W °C/W °C ELECTRICAL CHARACTERISTICS (8.0 V ≤ VBB ≤ 16.5 V, Gnd = 0 V, –40°C ≤ TJ ≤ 105°C; unless otherwise stated. Note 3.) Parameter VBB Input VBB Input Voltage IBB0 Current Reset Mode DIN, CLK, STB Inputs VIL1, Input Low Voltage VIH, Input High Voltage IIL, Input Current GREN Input VIL, Input Low Voltage VIH, Input High Voltage IIH, Input Pull–down Current GRID1, GRID2, GRID3 Outputs IOL IOH VOL VOH AN24 – AN29 Outputs IOL IOH VOL VOH Sink Current Source Current IOUT = 400 µA IOUT = –20 mA 400 20 – VBB – 0.5 – – – – – – 0.5 VBB µA mA V V Sink Current Source Current IOUT = 1.0 mA IOUT = –50 mA, VBB = 12 V 1.0 50 – VBB – 0.75 – – – – – – 0.5 VBB mA mA V V VIN = 3.325 V – – – 3.3 – – – 30 1.6 – 60 V V µA VIN = VIH – – – 3.3 – – – 7.5 1.6 – 20.0 V V µA – No outputs active, VBB = 16.5 V All outputs forced low. 8.0 – – – 2.0 6.5 16.5 5.0 7.5 V mA V Test Conditions Min Typ Max Unit 3. Designed to meet these characteristics over the stated voltage and temperature ranges, though may not be 100% parametrically tested .


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