K4C89093AF

www.DataSheet4U.com K4C89183AF 288Mb x18 Network-DRAM2 Specification Version 0.7 - 1 - REV. 0.7 Jan. 2005 K4C89183AF Revision History Version 0.0 (Oct. 2002) - First Release Version 0.01 (Nov. 2002) - Changed die revision from D-die to F-die - Corrected typo - Corrected DQS to DS and QS(DQS -> DS and QS) in AC timing table and timing diagram. Version 0.1 (Apr. 2003) - Added 800Mbps(400Mhz) product - Changed operating temperature from Ta to Tc. - Changed capacitance of ADDR/CMD/CLK From Min Addr/CMD/CLK 1.5 Max 2.5 Min 1.5 To Max 3.0 - Changed tDSS(DS input Falling Edge to Clock Setup Time) From F6 CL4 CL5 CL6 CL7 0.9 0.9 0.9 FB 0.9 0.9 0.9 F5 1.0 1.0 1.0 G7 0.75 0.75 0.75 0.75 F6 0.75 0.75 0.75 To FB 0.8 0.8 0.8 F5 1.0 1.0 1.0 - - Added CL7 for 800Mbps - Deleted TSOP package outline Version 0.11 (Apr. 2003) - Corrected typo in page 3.(Deleted bi-directional strobe) - Corrected min. Vref to VDDQ/2x95% in page 7 Version 0.2 (Aug. 2003) - Added package physical dimension - Extracted 800Mbps(G7) binning from target spec ( G7 will be added in the future) - Changed DC test condition From IDD1S,IDD2N,IDD2P,IDD5,IDD6 - Changed low frequency spec like below From Unit : ns tCK max@CL=4 tCK max@CL=5 tCK max@CL=6 F6 7.5 7.5 7.5 FB 7.5 7.5 7.5 F5 7.5 7.5 7.5 F6 6.0 6.0 6.0 To FB 6.0 6.0 6.0 F5 6.0 6.0 6.0 To IDD1S,IDD2N,IDD2P,IDD5B,IDD6 IDD4W, IDD4R Changed point Changed condition newly inserted - Changed AC test load picture Version 0.3 (Nov. 2003) - Changed Packge type from die-...