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IGBT MODULE
2MBI300U4H-170 MS5F 6137
May. 27 ¶05 May. 27 ¶05
S.Miyashita T.Miyasaka
Y.Seki
K.Yamada
MS5F6137
1 13
*D
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May.-27 - ¶05
'PCEVOGPV
T.Miyasaka K.Yamada
Y.Seki
MS5F6137
2 13
*D
2MBI300U4H-170
1. Outline Drawing ( Unit : mm )
2. Equivalent circuit
MS5F6137
3 13
*C
3.Absolute Maximum Ratings ( at Tc= 25°C unless otherwise specified
Items Collector-Emitter voltage Gate-Emitter voltage Sym bols VCES VGES Ic Collector current Icp -Ic -Ic pulse Pc Tj Tstg Viso Continuous 1ms Tc=25°C Tc=80°C Tc=25°C Tc=80°C Conditions Maximum Ratings 1700 ±20 400 300 800 600 300 600 1470 150 -40 ~ +125 3400 3.5 4.5 Units V V
A
Collector Power Dissipation Junction temperature Storage temperature Isolation between terminal and copper base (*1) voltage Screw Torque Mounting (*2) Terminals (*3)
1ms 1 device
W °C VAC Nm
AC : 1min.
(*1) All terminals should be connected together when isolation test will be done. (*2) Recommendable Value : Mounting 2.5~3.5 Nm (M5 or M6) (*3) Recommendable Value : Terminals 3.5~4.5 Nm (M6)
4. Electrical characteristics ( at Tj= 25°C unless otherwise specified)
Items
Zero gate voltage Collector current Gate-Emitter leakage current Gate-Emitter threshold voltage Collector-Emitter saturation voltage Input capacitance Turn-on time
Symbols
ICES IGES VGE(th) VCE(sat) (terminal) VCE(sat) (chip) Cies ton tr tr (i) toff tf VF (terminal) VF (chip) trr R lead
Conditions
VGE = 0V VCE = 1700V VCE = 0V VGE=±20V VCE = 20V Ic = 300mA Tj= 25°C Tj=125°C Tj= 25°C Ic = 300A Tj=125°C VCE=10V,VGE=0V,f=1MHz Vcc = 900V Ic = 300A VGE=±15V Rg = 1.5 ȍ VGE=15V Tj= 25°C Tj=125°C Tj= 25°C Tj=125°C
Characteristics min. typ. max.
4.5 6.5 2.45 2.85 2.25 2.65 28 0.62 0.39 0.05 0.55 0.09 2.00 2.20 1.80 2.00 0.53 4.0 800 8.5 2.60 2.40 1.20 0.60 1.50 0.30 2.35 2.15 0.6 -
Units
mA nA V
V
nF
ȝs
Turn-off time
VGE=0V IF = 300A IF = 300A
Forward on voltage
V
Reverse recovery time Lead resistance, terminal-chip(*4)
ȝs mȍ
(*4) Biggest internal terminal resistance among arm.
MS5F6137
4 13
*C
5. Thermal resistance characteristics Items
Thermal resistance(1device) Contact Thermal resistance (1device) (*5)
Symbols
Rth(j-c) Rth(c-f) IGBT FWD
Conditions
Characteristics min. typ. max.
0.0125 0.085 0.14 -
Units
°C/W
with Thermal Compound
(*5) This is the value which is defined mounting on the additional cooling fin with thermal compound.
6. Indication on module Logo of production
2MBI300U4H-170
300A 1700V
Lot.No.
Place of manufacturing (code)
7.Applicable category
This specification is applied to IGBT Module named 2MBI300U4H-170 .
8.Storage and transportation notes
The module should be stored at a standard temperature of 5 to 35°C and humidity of 45 to 75% . Store modules in a place with few temperature changes in order to avoid condensation on the module surface. Avoid exposure to corrosive gases and dust. Avoid excessive external force on the module. Store modules with unprocessed terminals. Do not drop or otherwise shock the modules when transporting.
9. Definitions of switching time
8
.
8 8 )' VT T +T T
8%'
8 EE
+E
4) 8 )'
8 %' +E
8 #
VT
K VT VQ P VQ H H
+E
8%' VH
10. Packing and Labeling
Display on the packing box - Logo of production - Type name - Lot No - Products quantity in a packing box
MS5F6137
5 13
*C
11. Reliability test results
Reliability Test Items
Test categories Test items 1 Terminal Strength (Pull test) 2 Mounting Strength Pull force Test time Screw torque Test methods and conditions : 40N : 10±1 sec. : 2.5 ~ 3.5 Nm (M5) 3.5 ~ 4.5 Nm (M6) Test time : 10±1 sec. Range of frequency : 10 ~ 500Hz Sweeping time : 15 min. Acceleration : 100m/s2 Sweeping direction : Each X,Y,Z axis Test time : 6 hr. (2hr./direction) Maximum acceleration : 5000m/s2 Pulse width : 1.0msec. Direction : Each X,Y,Z axis Test time : 3 times/direction Storage temp. : 125±5 Test duration : 1000hr. Storage temp. : -40±5 Test duration : 1000hr. Storage temp. : 85±2 Relative humidity : 85±5% Test duration : 1000hr. Test temp. : 1202 Test humidity : 85±5% Test duration : 96hr. Test temp. : Low temp. -405 High temp. 125 5 RT 5 ~ 35 : High ~ RT ~ Low ~ RT 1hr. 0.5hr. 1hr. 0.5hr. : 100 cycles : High temp. 100
+0 -5
(Aug.-2001 edition)
Reference Number Acceptnorms of ance EIAJ ED-4701 sample number 5 5 (0:1) (0:1)
Mechanical Tests
Test Method 401 Method Test Method 402 method Test Method 403 Reference 1 Condition code B
3 Vibration
5
(0:1)
4 Shock
Test Method 404 Condition code B
5
(0:1)
1 High Temperature Storage 2 Low Temperature Storage 3 Temperature Humidity Storage 4 Unsaturated Pressurized Vapor
Test Method 201 Test Method 202 Test Method 103 Test code C Test Method 103 Tes.