Power MOSFET
NTLGD3502N
Power MOSFET
20 V, 5.8 A/4.6 A Dual N-Channel,
DFN6 3x3 mm Package
Features
•ăExposed Drain Package •ăExcel...
Description
NTLGD3502N
Power MOSFET
20 V, 5.8 A/4.6 A Dual N-Channel,
DFN6 3x3 mm Package
Features
ăExposed Drain Package ăExcellent Thermal Resistance for Superior Heat Dissipation ăLow Threshold Levels ăLow Profile (< 1 mm) Allows It to Fit Easily into Extremely Thin
Environments
ăThis is a Pb-Free Device
Applications
ăDC-DC Converters (Buck and Boost Circuits) ăPower Supplies ăHard Disk Drives
MOSFET I MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current (Note 1)
Steady State
Power Dissipation (Note 1)
t ≤ 5.0 s
Steady State
TA = 25°C TA = 85°C TA = 25°C
TA = 25°C
VDSS VGS ID
PD
20 ±20 4.3 3.0 5.8 1.74
V V A
W
Pulsed Drain Current
t ≤10 ms
IDM
Operating Junction and Storage Temperature TJ, TSTG
17.2
-55 to 150
A
°C
Source Current (Body Diode)
Lead Temperature for Soldering Purposes (1/8” from case for 10 s)
IS 1.6 A TL 260 °C
MOSFET II MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current (Note 1)
Steady State
Power Dissipation (Note 1)
t ≤ 5.0 s
Steady State
TA = 25°C TA = 85°C TA = 25°C
TA = 25°C
VDSS VGS ID
PD
20 ±12 3.6 2.5 4.6 1.74
V V A
W
Pulsed Drain Current
t ≤10 ms
IDM
Operating Junction and Storage Temperature TJ, TSTG
13.8
-55 to 150
A
°C
Source Current (Body Diode)
Lead Temperature for Soldering Purposes (1/8” from case for 10 s)
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