Document
NLAS4717
Analog Switch, High Bandwidth, Dual SPDT
The NLAS4717 is an advanced CMOS analog switch fabricated in
sub-micron silicon gate CMOS technology. The device is a dual
independent Single Pole Double Throw (SPDT) switch featuring two
low RDS(on) of 4.5 W at 3.0 V.
The device also features guaranteed Break-Before-Make (BBM)
switching, assuring the switches never short the driver.
The NLAS4717 is available in two small size packages:
♦ăMicro10:
3.0 x 5.0 mm
♦ăFlip-Chip-10: 2.0 x 1.5 mm
Features
•ăLow RDS(on): 4.5 W @ 3.0 V •ăMatching Between the Switches ±0.5 W •ăWide Low Voltage Range: 1.8 V to 5.5 V •ăHigh Bandwidth > 40 MHz •ă1.65 V to 5.5 V Operating Range •ăLow Threshold Voltages on Pins 4 and 8 (CTRL Pins) •ăUltra-Low Charge Injection ≤ 6.0 pC •ăLow Standby Current – ICC = 1.0 nA (Max) @ TA = 25°C •ăOVT* on Pins 4 and 8 (CTRL Logic Pins) •ăPb-Free Packages are Available
Typical Applications
•ăCell Phones •ăPDAs •ăMP3s •ăDigital Still Cameras
Important Information
•ăESD Protection:
HBM = 2000 V, MM = 200 V
•ăLatchup Max Rating: 200 mA (Per JEDEC EIA/JESD78) •ăPin-to-Pin Compatible with MAX4717
*OVT
•ăOvervoltage Tolerance (OVT) specific pins to operate higher than
normal supply voltages, with no damage to the devices or to signal integrity.
http://onsemi.com
MARKING DIAGRAMS
A1
FLIP-CHIP-10 CASE 489AA
4717 AYWWĂG
G A1
Micro10 CASE 846B
10
4717 AYWĂG
G
1
A
= Assembly Location
Y
= Year
W, WW = Work Week
G
= Pb-Free Package
FUNCTION TABLE
IN_
NO_
NC_
0
OFF
ON
1
ON
OFF
ORDERING INFORMATION
Device
Package
Shipping†
NLAS4717FCT1 Flip-Chip-10
3000 / Tape & Reel
NLAS4717FCT1G Flip-Chip-10 (Pb-Free)
NLAS4717MR2
Micro10
3000 / Tape & Reel
4000 / Tape & Reel
NLAS4717MR2G Micro10 (Pb-Free)
4000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2007
1
May, 2007 - Rev. 9
Publication Order Number: NLAS4717/D
NLAS4717
GND
VCC 1
10 NO2
B1
NC1 C1
A1 NC2
NO1 2
9 COM2
COM1 3 IN1 4 NC1 5
Micro10 (Top View)
8 IN2 7 NC2 6 GND
IN1 C2
COM1 C3
NO1 C4
B4
VCC Flip-Chip-10
(Top View)
A2 IN2 A3 COM2 A4 NO2
Figure 1. Device Circuit Diagrams and Pin Configurations
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V+
Positive DC Supply Voltage
*0.5 to )7.0
V
VIS
Analog Input Voltage (VNO, VNC, or VCOM) (Note 1)
*0.5 v VIS v VCC )0.5
V
VIN
Digital Select Input Voltage
*0.5 v VI v)7.0
V
IIK
DC Current, Into or Out of Any Pin (Continuous)
$100
mA
IPK
Peak Current (10% Duty Cycle)
$200
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Signal voltage on NC, NO, and COM exce.