DIM200PHM33-F000

www.DataSheet4U.com DIM200PHM33-F000 DIM200PHM33-F000 Half Bridge IGBT Module Preliminary Information DS5606-1.2 June 2003 FEATURES I I I I KEY PARAMETERS VCES VCE(sat) * IC IC(PK) (typ) (max) (max) 3300V 3.0V 200A 400A Soft Punch Through Silicon 10µs Short Circuit Withstand Isolated MMC Base with AlN Substrates High Thermal Cycling Capability * Measured at auxiliary terminals. APPLICATIONS I I I 1(E1/C2) 2(C1) 5(E1) 4(G1) 3(E2) 7(E2) 6(G2) High Reliability Inverters Motor Controllers Traction Auxiliaries The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 600V to 3300V and currents up to 3600A. The DIM200PHM33-F000 is a half bridge 3300V soft punch through, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) plus full 10µs short circuit withstand. This device is optimised for traction drives and other applications requiring high thermal cycling capability. The module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety. 8(C1) Fig. 1 Half bridge circuit diagram ORDERING INFORMATION Order As: DIM200PHM33-F000 Note: When ordering, please use the whole part number. Outline type code: P (See package details for further information) Fig. 2 Electrical connections ...