SMD1812

www.DataSheet4U.com POLYFUSE® RESETTABLE FUSES SMD1812 formerly No. 729 SMD Type, 6 V - 60 V Standard UL 1434 1st Edition CSA C22.2 No. 0 CSA TIL No. CA-3A Specifications Packaging A Materials Terminals: Blistertape and reel Ø 178 mm Solder-plated copper TS: Solder Material: 63/37 SnPb TF: Lead free plating on request Max. Device Surface Temperature in Tripped State 125 °C Operating / Storage Temperature -40 ºC to +85 ºC (consider derating) Humidity Ageing +85 °C, 85 % R.H., 1000 hours, ± 5 % typical resistance change Vibration MIL-STD-883C, Method 2007.1, Condition A, no change Thermal Shock MIL-STD-202F, Method 107G +85 °C to -40 °C 20 times, -30 % typical resistance change Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002, Category 3 Reflow only Solvent Resistance MIL-STD-202, Method 215, no change Marking “P”, Part Code Approvals cULus Recognition TÜV Features This product line is also designed for surface- WebLinks Dimensions (mm) mount applications. The products with 1812-mil footprint range in hold currents from 0.1 A to 2.6 A and voltage from 6 V to 60 V. These devices are suited for PC mother board, computer peripheral products and general electronics applications. Suitable for reflow soldering. Further info see: www.wickmanngroup.com www.wickmanngroup.com/download/fuseology.pdf 3.45 Further application info see fuseology: Solder pad Layout (mm) 3.15 1.78 1.78 Dimensions (mm) Model SMD1812P010TS/TF SMD1812P014TS/TF SMD1812P020TS/TF SMD1812P0...