FPT-20P-M04

www.DataSheet4U.com FUJITSU SEMICONDUCTOR DATA SHEET THIN SHRINK SMALL OUTLINE PACKAGE 20 PIN PLASTIC FPT-20P-M04 20-pin plastic TSSOP Lead pitch Package width × package length Lead shape Sealing method Mounting height Weight 0.65 mm 4.40 × 6.50 mm Gullwing Plastic mold 1.20 mmMAX 0.08g P-TSSOP20-4.4×6.5-0.65 (FPT-20P-M04) Code (Reference) 20-pin plastic TSSOP (FPT-20P-M04) Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max). Note 2) *2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder. 0.17±0.03 (.007±.001) 11 *1 6.50±0.10(.256±.004) 20 *24.40±0.10 INDEX 6.40±0.20 (.173±.004) (.252±.008) Details of "A" part 1.10±0.10 (Mounting height) (.043±.004) LEAD No. 1 10 0.65(.026) "A" 0.24±0.08 (.009±.003) 0.13(.005) M 0~8˚ 0.10(.004) 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.05±0.05 (Stand off) (.002±.002) 0.25(.010) C 2003 FUJITSU LIMITED F20014S-c-3-6 Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0212 ...