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WF512K32-xxx5 Dataheets PDF



Part Number WF512K32-xxx5
Manufacturers White Electronic Designs
Logo White Electronic Designs
Description 512Kx32 5V FLASH MODULE
Datasheet WF512K32-xxx5 DatasheetWF512K32-xxx5 Datasheet (PDF)

www.DataSheet4U.com WF512K32-XXX5 HI-RELIABILITY PRODUCT 512Kx32 5V FLASH MODULE, SMD 5962-94612 FEATURES s Access Times of 60, 70, 90, 120, 150ns s Packaging • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400 (1)) • 68 lead, 40mm, Low Capacitance Hermetic CQFP (Package 501) • 68 lead, 40mm, Low Profile 3.5mm (0.140"), CQFP (Package 502) • 68 lead, 22.4mm (0.880") Low Profile CQFP (G2U), 3.5mm (0.140") high, (Package 510) • 68 lead, 23.9mm (0.940") Low Profile CQFP (G1U), 3.5.

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www.DataSheet4U.com WF512K32-XXX5 HI-RELIABILITY PRODUCT 512Kx32 5V FLASH MODULE, SMD 5962-94612 FEATURES s Access Times of 60, 70, 90, 120, 150ns s Packaging • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400 (1)) • 68 lead, 40mm, Low Capacitance Hermetic CQFP (Package 501) • 68 lead, 40mm, Low Profile 3.5mm (0.140"), CQFP (Package 502) • 68 lead, 22.4mm (0.880") Low Profile CQFP (G2U), 3.5mm (0.140") high, (Package 510) • 68 lead, 23.9mm (0.940") Low Profile CQFP (G1U), 3.5mm (0.140") high, (Package 519) s 100,000 Erase/Program Cycles Minimum s Sector Architecture • 8 equal size sectors of 64KBytes each • Any combination of sectors can be concurrently erased. Also supports full chip erase s Organized as 512Kx32 s Commercial, Industrial and Military Temperature Ranges s 5 Volt Programming. 5V ± 10% Supply. s Low Power CMOS, 6.5mA Standby s Embedded Erase and Program Algorithms s TTL Compatible Inputs and CMOS Outputs s Built-in Decoupling Caps for Low Noise Operation s Page Program Operation and Internal Program Control Time s Weight WF512K32-XG2UX5 - 8 grams typical WF512K32-XH1X5 - 13 grams typical WF512K32-XG4X5 - 20 grams typical WF512K32-XG4TX5 - 20 grams typical WF512K32-XG1UX5 - 5 grams typical 1. Call factory for PGA type (HIP) package options. Note: See Flash Programming Application Note 4M5 for algorithms. FIG. 1 1 I/O8 I/O9 I/O10 A14 A16 A11 A0 A18 I/O0 I/O1 I/O2 11 PIN CONFIGURATION FOR WF512K32N-XH1X5 TOP VIEW 12 WE2 CS2 GND I/O11 A10 A9 A15 VCC CS1 NC I/O3 22 33 23 I/O15 I/O14 I/O13 I/O12 OE A17 WE1 I/O7 I/O6 I/O5 I/O4 I/O24 I/O25 I/O26 A7 A12 NC A13 A8 I/O16 I/O17 I/O18 44 34 VCC CS4 WE4 I/O27 A4 A5 A6 WE3 CS3 GND I/O19 55 45 I/O31 I/O30 I/O29 I/O28 A1 A2 A3 I/O23 I/O22 I/O21 I/O20 8 8 8 8 PIN DESCRIPTION 56 I/O0-31 A0-18 WE1-4 CS1-4 OE VCC GND NC Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected BLOCK DIAGRAM W E1 CS1 OE A0-18 512K x 8 512K x 8 W E2 CS2 W E3 CS3 W E4 CS4 512K x 8 512K x 8 66 I/O0-7 I/O8-15 I/O16-23 I/O24-31 April 2001 Rev. 4 1 White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520 WF512K32-XXX5 FIG. 2 PIN CONFIGURATION FOR WF512K32F-XG4X5 (Low Capacitance) AND WF512K32-XG4TX5 TOP VIEW NC A0 A1 A2 A3 A4 A5 CS1 GND CS3 WE A6 A7 A8 A9 A10 VCC PIN DESCRIPTION I/O0-31 A0-18 Data Inputs/Outputs Address Inputs Write Enable Chip Selects Output Enable Power Supply Ground Not Connected 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 8 8 8 WE 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 CS1-4 OE VCC GND NC BLOCK DIAGRAM CS 1 WE OE A0-18 512K x 8 512K x 8 CS 2 CS 3 CS 4 512K x 8 512K x 8 8 VCC A11 A12 A13 A14 A15 A16 CS2 OE.


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