8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
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White Electronic Designs
WEDPNF8M722V-XBX
8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-...
Description
www.DataSheet4U.com
White Electronic Designs
WEDPNF8M722V-XBX
8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED*
FEATURES
n n Sector Architecture
Package: 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm
One 16KByte, two 8KBytes, one 32KByte, and fifteen 64KBytes in byte mode One 8K word, two 4K words, one 16K word, and fifteen 32K word sectors in word mode. Any combination of sectors can be concurrently erased. Also supports full chip erase
n Boot Code Sector Architecture (Bottom) n Embedded Erase and Program Algorithms n
n Commercial, Industrial and Military Temperature Ranges n
Weight: WEDPNF8M722V-XBX - 2.5 grams typical
SDRAM PERFORMANCE FEATURES
n Organized as 8M x 72 n High Frequency = 100, 125MHz n Single 3.3V ±0.3V power supply n
Erase Suspend/Resume Supports reading data from or programing data to a sector not being erased
Fully Synchronous; all signals registered on positive edge of system clock cycle changed every clock cycle
BENEFITS
n n
n Internal pipelined operation; column address can be n Internal banks for hiding row access/precharge n Programmable Burst length 1,2,4,8 or full page n 4096 refresh cycles
44% SPACE SAVINGS Reduced part count 25% I/O Reduction
n Reduced I/O count n Suitable for hi-reliability applications n SDRAM Upgradeable to 16M x 72 density (contact
FLASH PERFORMANCE FEATURES
n User Configurable as 2Mx8, 1M x16 or 512K x 32 n Access Times of 100, 120, 150ns n 3.3 Volt for Read and Write Oper...
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